Question and Answer
LNP™ COMPOUNDS AND PC COPOLYMER RESINS
Cutting edge engineering applications may require thermoplastic components with enhanced properties. Through our advanced compounding capabilities and unique copolymer resin technologies, we can support customers to expand their possibilities.
High temperature resistant resins and compounds are also available under ULTEM™ Resin Family of High Heat Solutions and NORYL™ Resins families.
493 LNP™ THERMOCOMP™ COMPOUND
Grades Available: 493
Available in: Europe, Asia, Americas, MEA, Global, Greater China
GENERAL INFORMATION
DESCRIPTION
THERMOCOMP compounds enhance nearly any base resin for stiffness, heat resistance, dimensional tolerances – even specific gravity or processing parameters.
Thermocomp compounds based on high temperature resins enhance properties even in demanding high heat and chemical environments.
BENEFITS
BROAD RANGE OF RESINS
Available in more than 25 different base resins, including ULTEM polyetherimide (PEI) resin, polyetheretherketone (PEEK), various polyamides (PA), polyphenylene sulfide (PPS), and melt processible fluoropolymers. A number of reinforcing additives are used in Thermocomp compounds, including glass fiber, carbon fiber, glass beads and various minerals.
CLOSELY-TUNED ENGINEERING ATTRIBUTES
Can be formulated to meet specific engineering attributes, including strength, stiffness, specific gravity for weight management or solid feel, heat resistance, chemical resistance, flow properties, and dimensional stability. Can be used in demanding high temperature and chemical environments.
FLAME RETARDANCY
Can be compounded for flame retardancy (FR), including non-halogenated FR compounds.
COLORABILITY
Available in a wide range of opaque colors for improved aesthetics.
2C003
LNP THERMOCOMP 2C003 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
2C004
LNP THERMOCOMP 2C004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
2F004
LNP THERMOCOMP 2F004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
2F005
LNP THERMOCOMP 2F005 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 25% glass fiber.
EUROPEASIAAMERICAS
2X04505
LNP THERMOCOMP 2X04505 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
2X95787
LNP THERMOCOMP 2X95787 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% glass fiber.
ASIAAMERICAS
2X98703
LNP THERMOCOMP 2X98703 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
2Z004
LNP THERMOCOMP 2Z004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% milled glass.
EUROPEASIAAMERICAS
5C003
LNP THERMOCOMP 5C003 compound is based on Polyvinylidene Fluoride (PVDF) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
5C004
LNP THERMOCOMP 5C004 compound is based on Polyvinylidene Fluoride (PVDF) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
6F006
LNP THERMOCOMP 6F006 compound is a 30% glass fiber filled PBT/PC copolymer based compound, which has been optimized for LASER welding technology. Added features of this material include: infrared transparency, high modulus, improved warpage control, and optionally, a black color targeted for LASER transparency or for LASER absorption.
EUROPEASIAAMERICAS
6F006I
LNP THERMOCOMP 6F006I compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) blend containing 30% glass fiber. Added features of this grade include: Impact Modified.
EUROPEASIAAMERICAS
8K008V
LNP THERMOCOMP 8K008V is a Liquid Crystalline Polymer (LCP) based compound for Laser Direct Structuring application. Added features of this material are: High heat resistance for SMT processing. Smooth surface, low warpage and stable dielectric performance.
EUROPEASIAAMERICAS
8KF44VE
LNP THERMOCOMP 8KF44VE is a Liquid Crystalline Polymer (LCP) based compound for Laser Direct Structuring application. Added features of this material are: High heat resistance for robust SMT processing. High stiffness and thin-wall flame retardant.
EUROPEASIAAMERICAS
8MF44VG
LNP THERMOCOMP 8MF44VG is a Liquid Crystalline Polymer (LCP) based compound for Laser Direct Structuring application. Added features of this material are: High heat resistance for robust SMT processing. High stiffness and thin-wall flame retardant.
EUROPEASIAAMERICAS
9F005P
LNP THERMOCOMP 9F005P compound is based on Polycarbonate (PC) resin containing 25% glass fiber. Added features of this grade include: Exceptional Processing, CLTE close to Aluminum.
EUROPEASIAAMERICAS
9X02540
LNP THERMOCOMP 9X02540 compound is based on Polycarbonate / Polyester blend containing 20% glass fiber. Added features of this grade include: Flame Retardant, Improved Impact.
EUROPEASIAAMERICAS
9X02841
LNP THERMOCOMP 9X02841 compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) blend containing 15% glass fiber.
EUROPEASIAAMERICAS
9X06482
LNP THERMOCOMP 9X06482 compound is based on Nylon 4/6 resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
9X07430
LNP THERMOCOMP 9X07430 compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) blend containing glass fiber and talc. Added features of this grade include: Opaque, Weatherable.
EUROPEASIAAMERICAS
9X10312
LNP THERMOCOMP 9X10312 compound is based on Nylon blend containing 50% glass fiber. Added features of this grade include: Impact Modified, High Flow, Good Ductility, Low Moisture Absorption.
EUROPEASIAAMERICAS
9X10401H
LNP THERMOCOMP 9X10401H compound is based on Polyphenylsulfone (PPSU) containing proprietary fillers. Added features of this grade include: Healthcare, X-Ray Opaque.
EUROPEASIAAMERICAS
9X11428J
LNP THERMOCOMP 9X11428J compound is based on Polyphenylsulfone (PPSU) containing proprietary filler. Added features of this grade include: Healthcare, Low Extractables, Food Contact compliant.
EUROPEASIAAMERICAS
9X22141
LNP THERMOCOMP 9X22141 compound (also known as ER016141) is based on Polycarbonate (PC) and Acrylonitrile butadiene styrene (ABS) resins containing 20% glass fiber. Added features of this grade include: High Stiffness, Excellent Processing, Good Dimensional Stability, Good Impact Performance, UL94 HB Rating
EUROPEASIAAMERICAS
9X99089
LNP THERMOCOMP 9X99089 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
AB002
LNP THERMOCOMP AB002 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 10% glass bead.
ASIAAMERICAS
AC004
LNP THERMOCOMP AC004 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
AF001H
LNP THERMOCOMP AF001H compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 5% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
AF002
LNP THERMOCOMP AF002 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 10% glass fiber.
EUROPEAMERICAS
AF002XXC
LNP THERMOCOMP AF002XXC compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 10% glass fiber.
EUROPEASIAAMERICAS
AF003
LNP THERMOCOMP AF003 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 15% glass fiber.
EUROPEASIAAMERICAS
AF004
LNP THERMOCOMP AF004 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
AF004AH
LNP THERMOCOMP AF004AH compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
AF004AHP
LNP THERMOCOMP AF004AHP compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
AF004L
LNP THERMOCOMP AF004L compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% glass fiber. Added features of this grade include: Low Extractables.
EUROPEASIAAMERICAS
AF004XXY
LNP THERMOCOMP AF004XXY compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
AF006
LNP THERMOCOMP AF006 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 30% glass fiber.
EUROPEASIAAMERICAS
AF006XXZ
LNP THERMOCOMP AF006XXZ compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 30% glass fiber.
EUROPEAMERICAS
AF008
LNP THERMOCOMP AF008 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 40% glass fiber.
ASIAAMERICAS
AR002XXH
LNP THERMOCOMP AR002XXH compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 10% Barium Sulfate. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
AW00A
LNP THERMOCOMP AW00A compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing wollastonite.
EUROPEASIAAMERICAS
AX02749
LNP THERMOCOMP AX02749 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
AX04518
LNP THERMOCOMP AX04518 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
AX06437
LNP THERMOCOMP AX06437 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing proprietary fillers. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications.
EUROPEASIAAMERICAS
AX06472
LNP THERMOCOMP AX06472 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing glass fiber and proprietary fillers. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications.
EUROPEASIAAMERICAS
BF004
LNP THERMOCOMP BF004 compound is based on Styrene-Acrylonitrile (SAN) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
BF006
LNP THERMOCOMP BF006 compound is based on Styrene-Acrylonitrile (SAN) resin containing 30% glass fiber.
EUROPEASIAAMERICAS
CX05470
LNP THERMOCOMP CX05470 compound is based on Polystyrene (PS) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
D10001VI
LNP THERMOCOMP D10001VI is based on Polycarbonate (PC) resin. It is colorable, non Chlorinated and non Brominated, UL94 [email protected] LDS compound for antenna or electric circuit manufacturing. Added features of this material include good process-ability, high impact strength, robust flame retardant for thin-wall design, good color-ability.
EUROPEASIAAMERICAS
D10001VP
LNP THERMOCOMP D10001VP compound is based on Polycarbonate (PC) resin. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Non-Brominated, Non-Chlorinated Flame Retardant, High Impact Strength and Ductility under room and low temperatures and Good Outdoor Weathering performance. D10001VP is available in black only.
EUROPEASIAAMERICAS
D151
LNP THERMOCOMP D151 compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: High Modulus, Good Surface, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
D151RC
LNP THERMOCOMP D151RC compound is based on recycled Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: High Modulus, Good Surface, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 35%.
EUROPEASIAAMERICAS
D151RCC
LNP THERMOCOMP D151RCC compound is based on recycled Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: High Modulus, Good Surface, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 50%.
EUROPEASIAAMERICAS
D251
LNP THERMOCOMP D251 compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
D251RC
LNP THERMOCOMP D251RC compound is based on recycled Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 35%.
EUROPEASIAAMERICAS
D251RCC
LNP THERMOCOMP D251RCC compound is based on recycled Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Colorable, High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 40%
EUROPEASIAAMERICAS
D251U
LNP THERMOCOMP D251U compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant, Good UV Stability.
EUROPEASIAAMERICAS
D351
LNP THERMOCOMP D351 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
D351RC
LNP THERMOCOMP D351RC compound is based on recycled Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 35%.
EUROPEASIAAMERICAS
D351RCC
LNP THERMOCOMP D351RCC compound is based on recycled Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 40%.
EUROPEASIAAMERICAS
D451
LNP THERMOCOMP D451 compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
D451RC
LNP THERMOCOMP D451RC compound is based on recycled Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 35%.
EUROPEASIAAMERICAS
D451RCC
LNP™ THERMOCOMP™ COMPOUND D451RCC is a compound based on Recycle Polycarbonate resin containing Glass Fiber, Flame Retardant. Added features of this material include high modulus, good flatness, good impact performance, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) polycarbonate content up to 35%.
EUROPEASIAAMERICAS
D452
LNP THERMOCOMP D452 compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant, High Flow, IMR/IMD Capability.
EUROPEASIAAMERICAS
D551
LNP THERMOCOMP D551 compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
D551RC
LNP THERMOCOMP D551RC compound is based on recycled Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) Polycarbonate content up to 30%.
EUROPEASIAAMERICAS
D551RCC
LNP THERMOCOMP COMPOUND D551RCC is a compound based on Recycle Polycarbonate resin containing Glass Fiber, Flame Retardant. Added features of this material include high modulus, good flatness, good impact performance, Non-Brominated & Non-Chlorinated Flame Retardant. Post-Consumer Recycling (PCR) polycarbonate content up to 25%.
EUROPEASIAAMERICAS
DB008ERP
LNP THERMOCOMP DB008ERP compound is based on Polycarbonate (PC) resin containing 40% glass bead. Added features of this grade include: Easy Molding, Mold Release.
EUROPEASIAAMERICAS
DC0041
LNP THERMOCOMP COMPOUND DC0041 is a compound based on Polycarbonate resin containing Carbon Fiber. Added feature of this grade is: Flame Retardant.
EUROPEASIAAMERICAS
DC0041PD
LNP THERMOCOMP COMPOUND DC0041PD is a compound based on Polycarbonate resin containing Carbon Fiber. Added feature of this grade is: Flame Retardant.
EUROPEASIAAMERICAS
DC0041PE
LNP THERMOCOMP COMPOUND DC0041PE is a compound based on Polycarbonate resin containing Carbon Fiber. Added feature of this grade is: Flame Retardant, PCR content up to 30%
EUROPEASIAAMERICAS
DC0041PQ
LNP THERMOCOMP DC0041PQ compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Non-Brominated, Non- Chlorinated Flame Retardant, Exceptional Processing.
EUROPEASIAAMERICAS
DC0041PR
LNP THERMOCOMP DC0041PR compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Non-Brominated, Non-Chlorinated Flame Retardant, PCR content up to 30%.
EUROPEASIAAMERICAS
DC0041XX5
LNP THERMOCOMP DC0041XX5 compound is based on PC Copolymer Resin containing 20% carbon fiber suitable for injection molding applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength. This halogen-free flame retardant resin is EN45545 R6 HL3 compliant and is targeted for train interior applications (category R6).
EUROPEASIAAMERICAS
DC0049XF
LNP THERMOCOMP DC0049XF compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant.
EUROPEASIAAMERICAS
DC004E
LNP THERMOCOMP DC004E compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
EUROPEASIAAMERICAS
DC0051
LNP THERMOCOMP COMPOUND DC0051 is a compound based on Polycarbonate resin containing >20% Carbon Fiber. Added feature of this grade is: Flame Retardant
EUROPEASIAAMERICAS
DC006
LNP THERMOCOMP DC006 compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DC006ER
LNP THERMOCOMP DC006ER compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Easy Molding, Mold Release, Electrically Conductive.
EUROPEASIAAMERICAS
DC006ERH
LNP THERMOCOMP DC006ERH compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding, Mold Release, Healthcare.
EUROPEASIAAMERICAS
DF002
LNP THERMOCOMP DF002 compound is based on Polycarbonate (PC) resin containing 10% glass fiber.
EUROPEASIAAMERICAS
DF0029P
LNP THERMOCOMP DF0029P compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Exceptional Processing. Flame Retardant.
EUROPEASIAAMERICAS
DF002ER
LNP THERMOCOMP DF002ER compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding. Mold Release
EUROPEAMERICAS
DF002ERH
LNP THERMOCOMP DF002ERH compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding, Healthcare, Mold Release.
EUROPEASIAAMERICAS
DF002FV
LNP THERMOCOMP DF002FV compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Good Surface Aesthetics and Wide Processing Window.
EUROPEASIAAMERICAS
DF002FVQ
LNP THERMOCOMP DF002FVQ compound is based on Polycarbonate (PC) resin containing 10% glass fiber and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Good Adhesion Strength, UL94 [email protected] (black).
EUROPEASIAAMERICAS
DF002H
LNP THERMOCOMP DF002H compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
DF003E
LNP THERMOCOMP DF003E compound is based on Polycarbonate (PC) resin containing 15% glass fiber. Added features of this grade include: Easy Molding.
EUROPEASIAAMERICAS
DF004
LNP THERMOCOMP DF004 compound is based on Polycarbonate (PC) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
DF0041VI
LNP THERMOCOMP DF0041VI compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Non-Brominated, Non-Chlorinated Flame Retardant, Wide Processing Window.
EUROPEASIAAMERICAS
DF0046P
LNP THERMOCOMP DF0046P compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Exceptional Processing, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
DF0049
LNP THERMOCOMP DF0049 compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Flame Retardant.
EUROPEASIAAMERICAS
DF0049P
LNP THERMOCOMP DF0049P compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Exceptional Processing, Flame Retardant.
EUROPEASIAAMERICAS
DF004AT
LNP THERMOCOMP DF004AT compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Transparent/Translucent, High stiffness/Strength
EUROPEASIAAMERICAS
DF004AXC
LNP THERMOCOMP DF004AXC compound is based on Polycarbonate (PC) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
DF004ER
LNP THERMOCOMP DF004ER compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Easy Molding, Mold Release.
EUROPEASIAAMERICAS
DF004EXP
LNP THERMOCOMP DF004EXP compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
AMERICASASIAEUROPEGREATER CHINAMEA
DF004P
LNP THERMOCOMP DF004P compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Exceptional Processing.
ASIAAMERICAS
DF004RXP
LNP THERMOCOMP DF004RXP compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Mold Release.
EUROPEASIAAMERICAS
DF004XXC
LNP THERMOCOMP DF004XXC compound is based on Polycarbonate (PC) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
DF005
LNP THERMOCOMP DF005 compound is based on Polycarbonate (PC) resin containing 25% glass fiber.
EUROPEASIAAMERICAS
DF006
LNP THERMOCOMP DF006 compound is based on Polycarbonate (PC) resin containing 30% glass fiber.
EUROPEASIAAMERICAS
DF0061VI
LNP THERMOCOMP DF0061VI compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Non-Brominated, Non-Chlorinated Flame Retardant, Wide Processing Window.
EUROPEASIAAMERICAS
DF0069P
LNP THERMOCOMP DF0069P compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Exceptional Processing. Flame Retardant.
EUROPEASIAAMERICAS
DF006AT
LNP THERMOCOMP DF006AT compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Transparent/Translucent, High stiffness/Strength
EUROPEASIAAMERICAS
DF006ER
LNP THERMOCOMP DF006ER compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Easy Molding, Mold Release.
EUROPEASIAAMERICAS
DF006ERH
LNP THERMOCOMP DF006ERH is a compound based on Polycarbonate resin containing 30% Glass Fiber. Added features of this material include: Healthcare, Easy Molding, Mold Release.
EUROPEASIAAMERICAS
DF006HL
LNP THERMOCOMP DF006HL compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Low Extractables, Healthcare.
EUROPEASIAAMERICAS
DF006LXN
LNP THERMOCOMP DF006LXN compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Low Extractables.
EUROPEASIAAMERICAS
DF006P
LNP THERMOCOMP DF006P compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Exceptional Processing.
EUROPEASIAAMERICAS
DF008
LNP THERMOCOMP DF008 compound is based on Polycarbonate (PC) resin containing 40% glass fiber.
EUROPEASIAAMERICAS
DF0081PI
LNP THERMOCOMP DF0081PI compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Improved Impact, Low Warpage, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
DF0084
LNP THERMOCOMP DF0084 compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
DF008ER
LNP THERMOCOMP DF008ER compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: Easy Molding, Mold Release.
EUROPEAMERICAS
DF008ERH
LNP THERMOCOMP DF008ERH compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: Easy Molding, Mold Release, Healthcare.
EUROPEASIAAMERICAS
DF00A1I
LNP THERMOCOMP DF00A1I compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Easy flow, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
DF00A1P
LNP THERMOCOMP DF00AIP compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
DF00A8P
LNP THERMOCOMP DF00A8P compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Improved Impact performance, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
DFZ22P
LNP THERMOCOMP DFZ22P compound is based on Polycarbonate (PC) resin containing 10% glass fiber, 10% milled glass. Added features of this grade include: Exceptional Processing.
EUROPEASIAAMERICAS
DX05475
LNP THERMOCOMP DX05475 compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Flame Retardant.
EUROPEASIAAMERICAS
DX05477
LNP THERMOCOMP DX05477 compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding, Mold Release, Flame Retardant.
EUROPEASIAAMERICAS
DX06094
LNP THERMOCOMP DX06094 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Impact, Non- Brominated & Non-Chlorinated Flame Retardant and Mold Release.
EUROPEASIAAMERICAS
DX06313
LNP THERMOCOMP DX06313 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Impact Modified, Thin-Wall Molding.
EUROPEASIAAMERICAS
DX06313I
LNP THERMOCOMP DX06313I compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Impact Modified, Thin-Wall Molding, Improved Flow.
EUROPEASIAAMERICAS
DX06409
LNP THERMOCOMP DX06409 compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding, Mold Release, Low Extractables, Healthcare.
EUROPEASIAAMERICAS
DX06411
LNP THERMOCOMP DX06411 compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Easy Molding, Mold Release.
EUROPEASIAAMERICAS
DX06411H
LNP THERMOCOMP DX06411H compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Easy Molding, Mold Release, Healthcare.
EUROPEASIAAMERICAS
DX07408
LNP THERMOCOMP DX07408 compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: Flame Retardant.
EUROPEASIAAMERICAS
DX09309
LNP THERMOCOMP DX09309 compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: High Dielectric Constant.
EUROPEASIAAMERICAS
DX09402
LNP THERMOCOMP DX09402 compound is based on Polycarbonate (PC) resin containing glass fiber. Added features of this grade include: Low Temperature Ductility, Easy Processing, UV Stabilized, Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
DX10311
LNP THERMOCOMP DX10311 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus and Good Ductility.
EUROPEASIAAMERICAS
DX10311X
LNP THERMOCOMP DX10311X compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: High Modulus and Good Ductility.
EUROPEASIAAMERICAS
DX10313
LNP THERMOCOMP DX10313 compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus and High Ductility.
EUROPEASIAAMERICAS
DX11354
LNP THERMOCOMP DX11354 compound is based on Polycarbonate (PC) resin containing proprietary fillers and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact.
EUROPEASIAAMERICAS
DX11354X
LNP THERMOCOMP DX11354X compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact, Colorable.
EUROPEASIAAMERICAS
DX11355
LNP THERMOCOMP DX11355 compound is based on Polycarbonate (PC) resin containing proprietary fillers and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact, Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
DX13006
LNP THERMOCOMP DX13006 compound is based on Polycarbonate (PC) resin containing 15% glass fiber. Added features of this grade include: Easy Molding.
EUROPEASIAAMERICAS
DX13354
LNP THERMOCOMP DX13354 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact, Good Surface Aesthetics and Wide Processing Window.
EUROPEASIAAMERICAS
DX13354X
LNP THERMOCOMP DX13354X compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Impact, Good Surface Aesthetics, Wide Processing Window and Colorable.
EUROPEASIAAMERICAS
DX14354X
LNP THERMOCOMP DX14354X compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Flow, Superior Impact, Colorable, Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
DX15354
LNP THERMOCOMP DX15354 compound is based on Polycarbonate (PC) resin containing proprietary fillers and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Heat Resistance.
EUROPEASIAAMERICAS
DZ004
LNP THERMOCOMP DZ004 compound is based on Polycarbonate (PC) resin containing 20% milled glass.
ASIAAMERICAS
EC004APQ
LNP THERMOCOMP EC004APQ compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, FAR25.853 Compliant.
EUROPEASIAAMERICAS
EC004XXC
LNP THERMOCOMP EC004XXC compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
EC005
LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
EC006
LNP THERMOCOMP EC006 compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
EC006APQ
LNP THERMOCOMP EC006APQ compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, High Flow, FAR25.853 Compliant.
EUROPEASIAAMERICAS
EC006AQW
LNP THERMOCOMP EC006AQW compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This grade has been pre-assessed and passed the material related tests from the ISO 10993 “Biological Evaluation of Medical Devices”.
EUROPEASIAAMERICAS
EC006E
LNP THERMOCOMP EC006E compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
EUROPEASIAAMERICAS
EC006PXQ
LNP THERMOCOMP EC006PXQ compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant.
EUROPEASIAAMERICAS
EC008
LNP THERMOCOMP EC008 compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
EC008APQ
LNP THERMOCOMP EC008APQ compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, High Flow. FAR25.853 Compliant.
EUROPEASIAAMERICAS
EC008PXQ
LNP THERMOCOMP EC008PXQ compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant.
EUROPEASIAAMERICAS
ECF62
LNP THERMOCOMP ECF62 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber, 10% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
EF002EXH
LNP THERMOCOMP EF002EXH compound is based on Polyetherimide (PEI) resin containing 10% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
EF004
LNP THERMOCOMP EF004 compound is based on Polyetherimide (PEI) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
EF004XXP
LNP THERMOCOMP EF004XXP compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: High Modulus, High Strength, Good Dimension Stability and Good Warpage Control.
EUROPEASIAAMERICAS
EF006
LNP THERMOCOMP EF006 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber.
EUROPEAMERICAS
EF006ER
LNP THERMOCOMP EF006ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Easy Molding, Mold Release.
EUROPEASIAAMERICAS
EF006H
LNP THERMOCOMP EF006H compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
EFB26ER
LNP THERMOCOMP EFB26ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber, 10% glass bead. Added features of this grade include: Easy Molding, Mold Release.
EUROPEASIAAMERICAS
EX00781H
LNP THERMOCOMP EX00781H is a compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
EX06430H
LNP THERMOCOMP EX06430H compound is based on Polyetherimide (PEI) resin containing mineral. Added features of this grade include: Healthcare, X-Ray Detectable.
EUROPEASIAAMERICAS
EX11414
LNP THERMOCOMP EX11414 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, FAR25.853 Compliant.
EUROPEASIAAMERICAS
EX93452
LNP THERMOCOMP EX93452 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
ASIAAMERICAS
FF004
LNP THERMOCOMP FF004 is a compound based on Polyethylene (PE) resin containing 20% Glass Fiber.
EUROPEASIAAMERICAS
FX10009
LNP THERMOCOMP FX10009 compound is based on Polyethylene (PE) resin containing proprietary fillers. Added features of this grade include: Improved Dielectric Properties.
EUROPEASIAAMERICAS
GF003
LNP THERMOCOMP GF003 compound is based on Polysulfone (PSU) resin containing 15% glass fiber.
EUROPEASIAAMERICAS
GF004
LNP THERMOCOMP GF004 compound is based on Polysulfone (PSU) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
GF006
LNP THERMOCOMP GF006 compound is based on Polysulfone (PSU) resin containing 30% glass fiber.
EUROPEAMERICAS
GX94043L
LNP THERMOCOMP GX94043L compound is based on Polysulfone (PSU) resin containing mineral. Added features of this grade include: Low Extractables.
EUROPEASIAAMERICAS
GZ004
LNP THERMOCOMP GZ004 compound is based on Polysulfone (PSU) resin containing 20% milled glass.
EUROPEASIAAMERICAS
HF006EU
LNP THERMOCOMP HF006EU compound is based on Nylon 11 resin containing 30% glass fiber. Added features of this grade include: Easy Molding, UV-Stabilized.
EUROPEASIAAMERICAS
HF008
LNP THERMOCOMP HF008 compound is based on Nylon 11 resin containing 40% glass fiber.
EUROPEASIAAMERICAS
IB008
LNP THERMOCOMP IB008 compound is based on Nylon 6/12 resin containing 40% glass bead.
EUROPEASIAAMERICAS
IF003
LNP THERMOCOMP IF003 compound is based on Nylon 6/12 resin containing 15% glass fiber.
EUROPEASIAAMERICAS
IF004
LNP THERMOCOMP IF004 compound is based on Nylon 6/12 resin containing 20% glass fiber.
ASIAAMERICAS
IF006
LNP THERMOCOMP IF006 compound is based on Nylon 6/12 resin containing 30% glass fiber.
EUROPEAMERICAS
IF006L
LNP THERMOCOMP IF006L compound is based on Nylon 6/12 resin containing 30% glass fiber. Added features of this grade include: Low Extractables.
EUROPEASIAAMERICAS
IF007
LNP THERMOCOMP* IF007 is a compound based on Nylon 6/12 resin containing 35% Glass Fiber.
EUROPEASIAAMERICAS
IF00C
LNP THERMOCOMP IF00C is a compound based on Nylon 6/12 resin containing 60% Glass Fiber.
EUROPEASIAAMERICAS
IX04513C
LNP THERMOCOMP IX04513C compound is based on Nylon 6/12 resin containing 30% glass fiber. Added features of this grade include: LNP Clean Compounding Technology.
EUROPEASIAAMERICAS
JF002
LNP THERMOCOMP JF002 compound is based on Polyethersulfone (PES) resin containing 10% glass fiber.
EUROPEASIAAMERICAS
JF002R
LNP THERMOCOMP JF002R compound is based on Polyethersulfone (PES) resin containing 10% glass fiber/glass bead. Added features of this grade include: Mold Release.
EUROPEASIAAMERICAS
JF003E
LNP THERMOCOMP JF003E compound is based on Polyethersulfone (PES) resin containing 15% glass fiber. Added features of this grade include: Easy Molding.
EUROPEASIAAMERICAS
JF004
LNP THERMOCOMP JF004 compound is based on Polyethersulfone (PES) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
JF004E
LNP THERMOCOMP JF004E compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
EUROPEASIAAMERICAS
JF004EXP
LNP THERMOCOMP JF004EXP compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
EUROPEASIAAMERICAS
JF004L
LNP THERMOCOMP JF004L compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: Low Extractables
EUROPEASIAAMERICAS
JF004RXP
LNP THERMOCOMP JF004RXP compound is based on Polyethersulfone (PES) resin containing glass fiber. Added features of this grade include: Mold Release.
EUROPEASIAAMERICAS
JF004Z
LNP THERMOCOMP JF004Z compound is based on Polyethersulfone (PES) resin containing 20% glass fiber. Added features of this grade include: High Viscosity, suitable for Extrusion.
EUROPEASIAAMERICAS
JF006
LNP THERMOCOMP JF006 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber.
EUROPEAMERICAS
JF006E
LNP THERMOCOMP JF006E compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.
EUROPEAMERICAS
JF006EXZ
LNP THERMOCOMP JF006EXZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.
EUROPEASIAAMERICAS
JF006LXZ
LNP THERMOCOMP JF006LXZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Low Extractables.
EUROPEASIAAMERICAS
JF006LZZ
LNP THERMOCOMP JF006LZZ compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Extrusion grade, Low Extractables.
EUROPEASIAAMERICAS
JX97000
LNP THERMOCOMP JX97000 compound is based on Polyethersulfone (PES) resin containing 30% glass fiber. Added features of this grade include: Mold Release.
EUROPEASIAAMERICAS
KB006
LNP THERMOCOMP KB006 compound is based on POM (Acetal) copolymer resin containing 30% glass bead.
EUROPEASIAAMERICAS
KF002
LNP THERMOCOMP KF002 compound is based on POM (Acetal) copolymer resin containing 10% glass fiber.
EUROPEASIAAMERICAS
KF002L
LNP THERMOCOMP KF002L compound is based on POM (Acetal) copolymer resin containing 10% glass fiber. Added features of this grade include: Low Extractables.
EUROPEASIAAMERICAS
KF002XXP
LNP THERMOCOMP KF002XXP compound is based on POM (Acetal) copolymer resin containing 10% glass fiber.
EUROPEASIAAMERICAS
KF004
LNP THERMOCOMP KF004 compound is based on POM (Acetal) copolymer resin containing 20% glass fiber.
EUROPEAMERICAS
KF004A
LNP THERMOCOMP KF004A compound is based on POM (Acetal) homopolymer resin containing 20% glass fiber.
EUROPEASIAAMERICAS
KF004AL
LNP THERMOCOMP KF004AL compound is based on Acetal (POM) Homopolymer resin containing 20% glass fiber. Added features of this grade include: Low Extractables.
EUROPEASIAAMERICAS
KF005
LNP THERMOCOMP KF005 compound is based on POM (Acetal) copolymer resin containing 25% glass fiber.
EUROPEASIAAMERICAS
KF006
LNP THERMOCOMP KF006 compound is based on POM (Acetal) copolymer resin containing 30% glass fiber.
EUROPEAMERICAS
KF006XXC
LNP THERMOCOMP KF006XXC compound is based on POM (Acetal) copolymer resin containing 30% glass fiber.
EUROPEASIAAMERICAS
KF008
LNP THERMOCOMP KF008 compound is based on POM (Acetal) copolymer resin containing 40% glass fiber.
EUROPEASIAAMERICAS
KFB11
LNP THERMOCOMP KFB11 compound is based on POM (Acetal) copolymer resin containing 5% glass fiber, 5% glass bead. Added features of this grade include: Low Warpage.
EUROPEASIAAMERICAS
KFZ24XXP
LNP THERMOCOMP KFZ24XXP compound is based on POM (Acetal) copolymer resin containing 20% glass fiber, 10% milled glass. Added features of this grade include: Low Warpage.
EUROPEASIAAMERICAS
KX97390
LNP THERMOCOMP KX97390 compound is based on POM (Acetal) copolymer resin containing 10% glass fiber.
EUROPEASIAAMERICAS
KZ002
LNP THERMOCOMP KZ002 compound is based on POM (Acetal) copolymer resin containing 10% milled glass.
EUROPEASIAAMERICAS
KZ006AXP
LNP THERMOCOMP KZ006AXP compound is based on POM (Acetal) homopolymer resin containing 30% milled glass.
EUROPEASIAAMERICAS
LC003E
LNP THERMOCOMP LC003E compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive
ASIAAMERICAS
LC004XXP
LNP THERMOCOMP LC004XXP compound is based on Polyetheretherketone (PEEK) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
LC006
LNP THERMOCOMP LC006 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEAMERICAS
LC006EX1
LNP THERMOCOMP LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: High Modulus, High impact, Easy Molding, Electrical Conductive.
EUROPEASIAAMERICAS
LC006EXQ
LNP THERMOCOMP LC006EXQ compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
EUROPEASIAAMERICAS
LC008E
LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
EUROPEASIAAMERICAS
LC008EXP
LNP THERMOCOMP LC008EXP compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
EUROPEASIAAMERICAS
LC008EXQ
LNP THERMOCOMP LC008EXQ compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
EUROPEASIAAMERICAS
LC00AEX1
LNP THERMOCOMP LC00AEX1 compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive, Ultra High Modulus and Strength, Easy Molding, Excellent Wear Resistance and Low CTE.
EUROPEASIAAMERICAS
LC00APXQ
LNP THERMOCOMP LC00APXQ compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Exceptional Processing, Electrically Conductive.
EUROPEASIAAMERICAS
LCF62E
LNP THERMOCOMP LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
EUROPEASIAAMERICAS
LF002
LNP THERMOCOMP LF002 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber.
EUROPEAMERICAS
LF002EXD-WT02005
LNP THERMOCOMP LF002EXD compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color, Easy Molding.
EUROPEASIAAMERICAS
LF002XXP-WT02005
LNP THERMOCOMP LF002XXP-WT02005 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color.
EUROPEASIAAMERICAS
LF003
LNP THERMOCOMP LF003 compound is based on Polyetheretherketone (PEEK) resin containing 15% glass fiber.
EUROPEASIAAMERICAS
LF004E
LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.
EUROPEASIAAMERICAS
LF004EX1
LNP THERMOCOMP LF004E1 compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding and Low Warpage
EUROPEASIAAMERICAS
LF006
LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber.
EUROPEASIAAMERICAS
LF006E
LNP THERMOCOMP LF006E compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Easy Molding.
EUROPEAMERICAS
LF006EX1
LNP THERMOCOMP LF006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Low warpage, Easy Molding.
EUROPEASIAAMERICAS
LF008
LNP THERMOCOMP LF008 compound is based on Polyetheretherketone (PEEK) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength.
ASIAAMERICAS
LF008EX1
LNP THERMOCOMP LF008EX1 compound is based on Polyetheretherketone (PEEK) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength, Easy Molding and Low Warpage.
EUROPEASIAAMERICAS
LFW55EX1
LNP THERMOCOMP LFW55EX1 compound is based on Polyetheretherketone (PEEK) resin containing 25% glass fiber and 25% mineral. Added features of this material include: Easy Molding, Dimensional Stability.
EUROPEASIAAMERICAS
LX03447
LNP THERMOCOMP LX03447 compound is based on Polyetheretherketone (PEEK) resin containing 35% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
LX04015
LNP THERMOCOMP LX04015 compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
EUROPEASIAAMERICAS
LX08411
LNP THERMOCOMP LX08411 compound is based on Polyetheretherketone (PEEK) resin containing 45% carbon fiber. Added features of this grade include: Electrically Conductive, High Modulus, Easy Molding.
EUROPEASIAAMERICAS
LX09404
LNP THERMOCOMP LX09404 compound is based on Polyetheretherketone (PEEK) resin containing 45% carbon fiber. Added features of this grade include: Electrically Conductive, High Modulus
EUROPEASIAAMERICAS
LX97024
LNP THERMOCOMP LX97024 compound is based on Polyetheretherketone (PEEK) resin containing 15% glass fiber, 5% PTFE. Added features of this grade include: Internally Lubricated, Easy Molding.
EUROPEASIAAMERICAS
M10006P
LNP THERMOCOMP* M10006P compound is based on Polypropylene (PP) resin containing non-halogenated Flame retardant suitable for use in composites and extrusion.
AMERICASASIAEUROPEGREATER CHINAMEA
MB006HS
LNP THERMOCOMP MB006HS compound is based on Polypropylene (PP) resin containing 30% glass bead. Added features of this grade include: Heat Stabilized, Healthcare.
EUROPEASIAAMERICAS
MB006S
LNP THERMOCOMP MB006S compound is based on Polypropylene (PP) resin containing 30% glass bead. Added features of this grade include: Heat Stabilized.
EUROPEAMERICAS
MB006SXP
LNP THERMOCOMP MB006SXP compound is based on Polypropylene (PP) resin containing 30% glass bead. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
MB008S
LNP THERMOCOMP MB008S compound is based on Polypropylene (PP) resin containing 40% glass bead. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
MC002
LNP THERMOCOMP MC002 compound is based on Polypropylene (PP) resin containing 10% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
MC004
LNP THERMOCOMP MC004 compound is based on Polypropylene (PP) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
MF002AS
LNP THERMOCOMP MF002AS compound is based on Polypropylene (PP) resin containing 10% glass fiber. Added features of this grade include: Heat Stabilized.
ASIAAMERICAS
MF002S
LNP THERMOCOMP MF002S compound is based on Polypropylene (PP) resin containing 10% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEAMERICAS
MF0049I
LNP THERMOCOMP MF0049I compound is based on Polypropylene (PP) resin containing 20% glass fiber. Added features of this grade include: Flame Retardant, Impact Modified.
EUROPEASIAAMERICAS
MF004ALS
LNP THERMOCOMP MF004ALS compound is based on Polypropylene (PP) resin containing 20% glass fiber. Added features of this grade include: Heat Stabilized, Low Extractables and Food Contact compliant.
EUROPEASIAAMERICAS
MF004AS
LNP THERMOCOMP MF004AS compound is based on Polypropylene (PP) resin containing 20% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
MF004S
LNP THERMOCOMP MF004S compound is based on Polypropylene (PP) resin containing 20% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEAMERICAS
MF006A
LNP THERMOCOMP MF006A compound is based on Polypropylene (PP) resin containing 30% glass fiber.
EUROPEASIAAMERICAS
MF006AS
LNP THERMOCOMP MF006AS compound is based on Polypropylene (PP) resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
MF006S
LNP THERMOCOMP MF006S compound is based on Polypropylene (PP) resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
MF006SXP
LNP THERMOCOMP MF006SXP compound is based on Polypropylene (PP) resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEAMERICAS
MF00AS
LNP THERMOCOMP MF00AS compound is based on Polypropylene (PP) resin containing 50% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
MFB22EXJ
LNP THERMOCOMP MFB22EXJ compound is based on Polypropylene (PP) resin containing 10% glass fiber and 10% glass bead. Added features of this grade include: Easy Molding, Low Extractables, Healthcare, Food Contact compliant.
EUROPEASIAAMERICAS
MFB41I
LNP THERMOCOMP MFB41I compound is based on Polypropylene (PP) resin containing 5% glass fiber, 20% glass bead. Added features of this grade include: Improved Impact.
EUROPEASIAAMERICAS
MFB429
LNP THERMOCOMP MFB429 compound is based on Polypropylene (PP) resin containing 10% glass fiber, 20% glass bead. Added features of this grade include: Flame Retardant.
EUROPEASIAAMERICAS
MFB63
LNP THERMOCOMP MFB63 compound is based on Polypropylene (PP) resin containing 30% glass bead and 15% glass fiber.
EUROPEASIAAMERICAS
MFB71L
LNP THERMOCOMP MFB71L compound is based on Polypropylene (PP) resin containing 35% glass bead, 5% glass fiber. Added features of this grade include: Low Extractables.
EUROPEASIAAMERICAS
MFB82I
LNP THERMOCOMP MFB82I compound is based on Polypropylene (PP) resin containing 10% glass fiber, 40% glass bead. Added features of this grade include: Improved Impact.
EUROPEASIAAMERICAS
MX00709
LNP THERMOCOMP MX00709 compound is based on Polypropylene (PP) resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
MX05484
LNP THERMOCOMP MX05484 compound is based on Polypropylene (PP) resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
MX06402H
LNP THERMOCOMP MX06402H compound is based on Polypropylene (PP) resin containing 20% glass fiber. Added features of this grade include: Heat Stabilized, Low Extractables, Healthcare.
EUROPEASIAAMERICAS
MX06403
LNP THERMOCOMP MX06403 compound is based on Polypropylene (PP) resin containing 20% glass fiber. Added features of this grade include: Heat Stabilized, UV Stabilized.
EUROPEASIAAMERICAS
MX85738
LNP THERMOCOMP MX85738 compound is based on Polypropylene (PP) resin containing 30% glass fiber.
EUROPEASIAAMERICAS
MX88028
LNP THERMOCOMP MX88028 compound is based on Polypropylene (PP) resin containing 10% glass fiber.
EUROPEASIAAMERICAS
MX89510
LNP THERMOCOMP MX89510 compound is based on Polypropylene (PP) resin containing 10% glass fiber, 10% glass bead.
EUROPEASIAAMERICAS
MX92284
LNP THERMOCOMP MX95319 compound is based on Polypropylene (PP) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
MX95319
LNP THERMOCOMP MX95319 compound is based on Polypropylene (PP) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
MX99432
LNP THERMOCOMP MX99432 compound is based on Polypropylene (PP) resin containing 15% glass fiber, 25% glass bead
EUROPEASIAAMERICAS
NF001
LNP THERMOCOMP NF001 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 5% glass fiber.
ASIAAMERICAS
NF002
LNP THERMOCOMP NF002 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 10% glass fiber.
ASIAAMERICAS
NF004
LNP THERMOCOMP NF004 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 20% glass fiber.
EUROPEASIAAMERICAS
NX10302
LNP THERMOCOMP NX10302 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications.
EUROPEASIAAMERICAS
NX11302
LNP THERMOCOMP NX11302 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Colorable, Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications.
EUROPEASIAAMERICAS
OC006
LNP THERMOCOMP OC006 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
OCF62E
LNP THERMOCOMP OCF62E compound is based on linear Polyphenylene Sulfide (PPS) resin containing 10% carbon fiber, 30% glass fiber. Added features of this grade include: Electrically Conductive, Easy Molding
EUROPEASIAAMERICAS
OF006
LNP THERMOCOMP OF006 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 30% glass fiber.
EUROPEASIAAMERICAS
OF006A
LNP THERMOCOMP OF006A compound is based on branched Polyphenylene Sulfide (PPS) resin containing 30% glass fiber.
EUROPEAMERICAS
OF008
LNP THERMOCOMP OF008 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 40% glass fiber.
EUROPEASIAAMERICAS
OF008A
LNP THERMOCOMP OF008A compound is based on branched Polyphenylene Sulfide (PPS) resin containing 40% glass fiber.
EUROPEASIAAMERICAS
OF008AE
LNP THERMOCOMP OF008AE compound is based on branched Polyphenylene Sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: Easy Molding.
EUROPEASIAAMERICAS
OF008E
LNP THERMOCOMP OF008E compound is based on linear Polyphenylene Sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: Easy Molding.
EUROPEASIAAMERICAS
OF008G
LNP THERMOCOMP OF008G compound is based on linear Polyphenylene Sulfide (PPS) resin containing 15% glass fiber, 25% milled glass.
EUROPEASIAAMERICAS
OF008H
LNP THERMOCOMP OF008H compound is based on linear Polyphenylene Sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
OF00AN
LNP THERMOCOMP OF00AN compound is based Polyphenylene Sulfide (PPS) containing 50% glass fiber. Added features include: High Modulus, Impact Modified, Low Chloride content, Good Warpage Control, Inherently Flame Retardant. Excellent High Heat and Chemical Resistance and Good Metal Bonding Strength targeted for Nano-Molding Technology (NMT) applications.
EUROPEASIAAMERICAS
OFC08
LNP THERMOCOMP OFC08 compound is based on Polyphenylene sulfide (PPS) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength, Good Impact Strength and Ductility, Excellent Heat and Chemical Resistance, Good Electrical properties and Inherently Flame-Retardant. It is also an Easy Flow grade with Good Flash Control. Applications of this grade include electric and electronic components, and various parts requiring high strength and high heat resistant.
EUROPEASIAAMERICAS
OFC08V
LNP THERMOCOMP OFC08V is a glass fiber reinforced Polyphenylene sulfide (PPS) compound. Added features include: high heat and chemical resistance, good warpage control and inherently flame-retardant, low flash and good processability, excellent LDS capability and plating performance, stable dielectric properties at various temperatures. Applications of this grade include 5G infrastructure and electronic components.
EUROPEASIAAMERICAS
OFC08XXP
LNP THERMOCOMP OFC08XXP compound is a 40% glass fiber reinforced polyphenylene sulfide. Added feature of this material include: High stiffness/strength, High flow, Low warpage, Impact resistant, Chemical resistance.
EUROPEASIAAMERICAS
OFM46
LNP THERMOCOMP OFM46 compound is based on Polyphenylene Sulfide (PPS) containing 50% glass fiber and minerals. Added features of this material include: high stiffness and strength, excellent dimensional stability and warpage control, good flame and chemical resistance, low coefficient of thermal expansion and moisture absorption.
EUROPEASIAAMERICAS
OMC0D
LNP THERMOCOMP OMC0D compound is a mineral reinforced polyphenylene sulfide. Added feature of this material include: high dielectric constant, low dissipation factor, good flame and chemical resistance, low moisture absorption.
EUROPEASIAAMERICAS
OMC0E
LNP THERMOCOMP OMC0E compound is a mineral reinforced polyphenylene sulfide. Added feature of this material include: high dielectric constant, low dissipation factor, good flame and chemical resistance, low moisture absorption.
EUROPEASIAAMERICAS
PB006EQ
LNP THERMOCOMP PB006EQ compound is based on Nylon 6 resin containing 30% glass bead. Added features of this grade include: Reduced Moisture.
EUROPEASIAAMERICAS
PB006SXS
LNP THERMOCOMP PB006SXS compound is based on Nylon 6 resin containing 30% glass bead. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
PCAF04FRHH
LNP THERMOCOMP PCA04FRHH compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 20 % glass fiber. Added features of this grade include: Non-Brominated, Non-Chlorinated Flame Retardants.
EUROPEASIAAMERICAS
PDXE00715EES
LNP THERMOCOMP PDXE00715EES compound is based on Polyetherimide (PEI) resin containing 10% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
PDXE98480
LNP THERMOCOMP PDXE98480 compound is based on Polyetherimide (PEI) resin containing 40% glass fiber.
EUROPEASIAAMERICAS
PF001S
LNP THERMOCOMP PF001S compound is based on Nylon 6 resin containing 5% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
PF002
LNP THERMOCOMP* PF002 is a compound based on Nylon 6 resin containing 10% Glass Fiber.
EUROPEASIAAMERICAS
PF004S
LNP THERMOCOMP PF004S compound is based on Nylon 6 resin containing 20% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
PF006
LNP THERMOCOMP PF006 compound is based on Nylon 6 resin containing 30% glass fiber.
EUROPEASIAAMERICAS
PF006S
LNP THERMOCOMP PF006S compound is based on Nylon 6 resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEAMERICAS
PF006U
LNP THERMOCOMP PF006U compound is based on Nylon 6 resin containing 30% glass fiber. Added features of this grade include: UV Stabilized.
EUROPEASIAAMERICAS
PF007
LNP THERMOCOMP PF007 compound is based on Nylon 6 resin containing 35% glass fiber.
EUROPEASIAAMERICAS
PF007S
LNP THERMOCOMP PF007S compound is based on Nylon 6 resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
PF008
LNP THERMOCOMP PF008 compound is based on Nylon 6 resin containing 40% glass fiber.
EUROPEASIAAMERICAS
PF008QS
LNP THERMOCOMP PF008QS compound is based on Nylon 6 resin containing 40% glass fiber. Added features of this grade include: Heat Stabilized, Reduced Moisture.
EUROPEASIAAMERICAS
PF008S
LNP THERMOCOMP PF008S compound is based on Nylon 6 resin containing 40% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
PF00ASXS
LNP THERMOCOMP PF00ASXS compound is based on Nylon 6 resin containing 50% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
PF00C
LNP THERMOCOMP PF00C compound is based on Nylon 6 resin containing 60% glass fiber.
EUROPEASIAAMERICAS
PF00DS
LNP THERMOCOMP PF00DS compound is based on Nylon 6 resin containing 65% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
PF00DS-BK1G298
LNP THERMOCOMP PF00DS compound is based on PA6 resin containing glass fiber. Added features of this grade include: Heat Stabilized, Custom color Black.
EUROPEASIAAMERICAS
PFB55
LNP THERMOCOMP PFB55 compound is based on Nylon 6 resin containing 25% glass bead, 25% glass fiber.
EUROPEASIAAMERICAS
PFB91S
LNP THERMOCOMP PFB91S compound is based on Nylon 6 resin containing 45% glass bead, 5% glass fiber.
ASIAAMERICAS
PFW53U
LNP THERMOCOMP PFW53U compound is based on Nylon 6 resin containing 15% glass fiber, 25% wollastonite. Added features of this grade include: UV Stabilized.
EUROPEASIAAMERICAS
PFW64
LNP THERMOCOMP PFW64 compound is based on Nylon 6 resin containing 20% glass fiber, 30% wollastonite.
EUROPEASIAAMERICAS
PX01658
LNP THERMOCOMP PX01658 compound is based on Nylon 6 resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
PX18002
LNP THERMOCOMP PX18002 compound is based on glass-filled Nylon 6 resin. Added features of this grade include: Dimensional Stability, Exceptional Processing, Good Aesthetics.
EUROPEASIAAMERICAS
PX92248
LNP THERMOCOMP PX92248 compound is based on Nylon 6 resin containing 30% glass fiber. Added features of this grade include: Improved Impact, UV Stabilized.
EUROPEASIAAMERICAS
QC006
LNP THERMOCOMP QC006 compound is based on Nylon 6/10 resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
QF006
LNP THERMOCOMP QF006 compound is based on Nylon 6/10 resin containing 30% glass fiber.
EUROPEASIAAMERICAS
QF0069
LNP THERMOCOMP QF0069 compound is based on Nylon 6/10 resin containing 30% glass fiber. Added features of this grade include: Flame Retardant.
EUROPEAMERICAS
QF007
LNP THERMOCOMP QF007 compound is based on Nylon 6/10 resin containing 35% glass fiber.
ASIAAMERICAS
QF008
LNP THERMOCOMP QF008 compound is based on Nylon 6/10 resin containing 40% glass fiber.
EUROPEASIAAMERICAS
QF00A
LNP THERMOCOMP QF00A compound is based on Nylon 6/10 resin containing 50% glass fiber.
EUROPEAMERICAS
QFC0AI
LNP THERMOCOMP QFC0AI compound is based on Nylon 6/10 resin containing 50% glass fiber. Added feature of this material include: high modulus, high impact, low dielectric constant, low moisture absorption, good dimensional stability and good chemical resistance.
EUROPEASIAAMERICAS
RB004
LNP THERMOCOMP RB004 compound is based on Nylon 6/6 resin containing 20% glass bead.
EUROPEAMERICAS
RB006
LNP THERMOCOMP RB006 compound is based on Nylon 6/6 resin containing 30% glass bead.
EUROPEASIAAMERICAS
RB008
LNP THERMOCOMP RB008 compound is based on Nylon 6/6 resin containing 40% glass bead.
EUROPEASIAAMERICAS
RB00A
LNP THERMOCOMP RB00A compound is based on Nylon 6/6 resin containing 50% glass bead.
EUROPEASIAAMERICAS
RC003
LNP THERMOCOMP RC003 compound is based on Nylon 6/6 resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
RC003SXS
LNP THERMOCOMP RC003SXS compound is based on Nylon 6/6 resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive, Heat Stabilized.
EUROPEASIAAMERICAS
RC004SXC
LNP THERMOCOMP RC004SXC compound is based on Nylon 6/6 resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Heat Stabilized.
EUROPEASIAAMERICAS
RC004SXS
LNP THERMOCOMP RC004SXS compound is based on Nylon 6/6 resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Heat Stabilized.
EUROPEAMERICAS
RC006
LNP THERMOCOMP RC006 compound is based on Nylon 6/6 resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
RC006XXH
LNP THERMOCOMP RC006XXH compound is based on Nylon 6/6 resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Healthcare.
EUROPEASIAAMERICAS
RC008
LNP THERMOCOMP RC008 compound is based on Nylon 6/6 resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
RC008ESS
LNP THERMOCOMP RC008ESS compound is based on Nylon 6/6 resin containing 40% carbon fiber. Added features of this grade include: ; Electrically Conductive, Easy Molding, Heat Stabilized.
EUROPEASIAAMERICAS
RC008H
LNP THERMOCOMP RC008H compound is based on Nylon 6/6 resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Healthcare.
EUROPEASIAAMERICAS
RC008XXQ
LNP THERMOCOMP RC008XXQ compound is based on Nylon 6/6 resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
RC00A
LNP THERMOCOMP RC00A compound is based on Nylon 6/6 resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
RF002
LNP THERMOCOMP RF002 compound is based on Nylon 6/6 resin containing 10% glass fiber.
EUROPEASIAAMERICAS
RF0029
LNP THERMOCOMP RF0029 compound is based on Nylon 6/6 resin containing 10% glass fiber. Added feature of this grade include: Flame Retardant.
EUROPEASIAAMERICAS
RF0029S
LNP THERMOCOMP RF0029S compound is based on Nylon 6/6 resin containing 10% glass fiber. Added features of this grade include: Flame Retardant, Heat Stabilized.
EUROPEASIAAMERICAS
RF002ES
LNP THERMOCOMP RF002ES compound is based on Nylon 6/6 resin containing 10% glass fiber. Added features of this grade include: Easy Molding, Heat Stabilized.
EUROPEASIAAMERICAS
RF002SXS
LNP THERMOCOMP RF002SXS compound is based on Nylon 6/6 resin containing 10% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
RF002XXH
LNP THERMOCOMP RF002XXH compound is based on Nylon 6/6 resin containing 10% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
RF0039S
LNP THERMOCOMP RF0039S compound is based on Nylon 6/6 resin containing 15% glass fiber. Added features of this grade include: Flame Retardant, Heat Stabilized.
EUROPEASIAAMERICAS
RF003AXH
LNP THERMOCOMP RF003AXH compound is based on Nylon 6/6 resin containing 15% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
RF003ES
LNP THERMOCOMP RF003ES compound is based on Nylon 6/6 resin containing 15% glass fiber. Added features of this grade include: Easy Molding, Heat Stabilized.
EUROPEASIAAMERICAS
RF003XXH
LNP THERMOCOMP RF003XXH compound is based on Nylon 6/6 resin containing 15% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
RF004
LNP THERMOCOMP RF004 compound is based on Nylon 6/6 resin containing 20% glass fiber.
EUROPEAMERICAS
RF0049S
LNP THERMOCOMP RF0049S compound is based on Nylon 6/6 resin containing 20% glass fiber. Added features of this grade include: Flame Retardant, Heat Stabilized.
EUROPEASIAAMERICAS
RF0049SP
LNP THERMOCOMP RF0049SP compound is based on Nylon 6/6 resin containing 20% glass fiber. Added features of this grade include: Flame Retardant, Heat Stabilized.
EUROPEASIAAMERICAS
RF004S
LNP THERMOCOMP RF004S compound is based on Nylon 6/6 resin containing 20% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
RF004XXD
LNP THERMOCOMP RF004XXD compound is based on Nylon 6/6 resin containing 20% glass fiber.
EUROPEASIAAMERICAS
RF004XXH
LNP THERMOCOMP RF004XXH compound is based on Nylon 6/6 resin containing 20% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
RF0057E
LNP THERMOCOMP RF0057E compound is based on Nylon 6/6 resin containing 25% glass fiber. Added features of this grade include: Non-Brominated & Non-Chlorinated Flame Retardant.
ASIAAMERICAS
RF005SXS
LNP THERMOCOMP* RF005SXS is a compound based on Nylon 66 resin containing 25% Glass Fiber. Added features of this material include: Heat Stabilized.
EUROPEASIAAMERICAS
RF006
LNP THERMOCOMP RF006 compound is based on Nylon 6/6 resin containing 30% glass fiber.
EUROPEASIAAMERICAS
RF0069S
LNP THERMOCOMP RF0069S compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Flame Retardant, Heat Stabilized.
EUROPEASIAAMERICAS
RF0069SZ
LNP THERMOCOMP RF0069SZ compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Flame Retardant, Heat Stabilized.
EUROPEASIAAMERICAS
RF0069XZ
LNP THERMOCOMP RF0069XZ compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Flame Retardant.
EUROPEASIAAMERICAS
RF006ESZ
LNP THERMOCOMP RF006ESZ compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Easy Molding, Heat Stabilized.
EUROPEASIAAMERICAS
RF006EXZ
LNP THERMOCOMP RF006EXZ compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Easy Molding.
EUROPEASIAAMERICAS
RF006L
LNP THERMOCOMP RF006L compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Low Extractables.
EUROPEASIAAMERICAS
RF006LXP
LNP THERMOCOMP RF006LXP compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Low Extractables.
EUROPEASIAAMERICAS
RF006S
LNP THERMOCOMP RF006S compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
RF006SXZ
LNP THERMOCOMP RF006SXZ compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
RF006XXH
LNP THERMOCOMP RF006XXH compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
RF006XXJ
LNP THERMOCOMP RF006XXJ compound is based on Nylon 6/6 resin containing 30% glass fiber. Added features of this grade include: Healthcare, Low Extractables, Food Contact compliant.
EUROPEASIAAMERICAS
RF006XXY
LNP THERMOCOMP RF006XXY compound is based on Nylon 6/6 resin containing 30% glass fiber.
EUROPEASIAAMERICAS
RF006XXZ
LNP THERMOCOMP RF006XXZ compound is based on Nylon 6/6 resin containing 30% glass fiber.
EUROPEASIAAMERICAS
RF0079SZ
LNP THERMOCOMP RF0079SZ compound is based on Nylon 6/6 resin containing 35% glass fiber. Added features of this grade include: Flame Retardant, Heat Stabilized.
ASIAAMERICAS
RF007ES
LNP THERMOCOMP RF007ES compound is based on Nylon 6/6 resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized, Easy Molding.
EUROPEASIAAMERICAS
RF007H
LNP THERMOCOMP RF007H compound is based on Nylon 6/6 resin containing 35% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
RF007SXN
LNP THERMOCOMP RF007SXN compound is based on Nylon 6/6 resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized, Hydro-Stable, NSF Listed.
EUROPEASIAAMERICAS
RF007SXP
LNP THERMOCOMP RF007SXP compound is based on Nylon 6/6 resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
RF007SXQ
LNP THERMOCOMP RF007SXQ compound is based on Nylon 6/6 resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized, Hydrolysis Resistant.
EUROPEAMERICAS
RF008
LNP THERMOCOMP RF008 compound is based on Nylon 6/6 resin containing 40% glass fiber.
ASIAAMERICAS
RF008ESZ
LNP THERMOCOMP RF008ESZ compound is based on Nylon 6/6 resin containing 40% glass fiber. Added features of this grade include: Easy Molding, Heat Stabilized.
EUROPEASIAAMERICAS
RF008H
LNP THERMOCOMP RF008H compound is based on Nylon 6/6 resin containing 40% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
RF008XXH
LNP THERMOCOMP RF008XXH compound is based on Nylon 6/6 resin containing 40% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
RF008XXZ
LNP THERMOCOMP RF008XXZ compound is based on Nylon 6/6 resin containing 40% glass fiber.
EUROPEAMERICAS
RF009H
LNP THERMOCOMP RF009H compound is based on Nylon 6/6 resin containing 45% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
RF009S
LNP THERMOCOMP RF009S compound is based on Nylon 6/6 resin containing 45% glass fiber. Added features of this grade include: Heat Stabilized.
ASIAAMERICAS
RF00AH
LNP THERMOCOMP RF00AH compound is based on Nylon 6/6 resin containing 50% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
RF00AS
LNP THERMOCOMP RF00AS compound is based on Nylon 6/6 resin containing 50% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
RF00C
LNP THERMOCOMP RF00C compound is based on Nylon 6/6 resin containing 60% glass fiber.
EUROPEAMERICAS
RF00CSXP
LNP THERMOCOMP RF00CSXP compound is based on Nylon 6/6 resin containing 60% glass fiber. Added features of this grade include: Heat Stabilized
EUROPEASIAAMERICAS
RF00CSXS
LNP THERMOCOMP RF00CSXS compound is based on Nylon 6/6 resin containing 60% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIA
RF00CSXZ
LNP THERMOCOMP RF00CSXZ compound is based on Nylon 6/6 resin containing 60% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
RF00CXXY
LNP THERMOCOMP RF00CXXY compound is based on Nylon 6/6 resin containing 60% glass fiber.
EUROPEASIAAMERICAS
RFB53XXZ
LNP THERMOCOMP RFB53XXZ compound is based on Nylon 6/6 resin containing 15% glass fiber, 25% glass bead.
ASIAAMERICAS
RFB66
LNP THERMOCOMP RFB66 compound is based on Nylon 6/6 resin containing 30% glass fiber, 30% glass bead.
ASIAAMERICAS
RFB71S
LNP THERMOCOMP RFB71S compound is based on Nylon 6/6 resin containing 5% glass fiber, 35% glass bead. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
RFZ349XC
LNP THERMOCOMP RFZ349XC compound is based on Nylon 6/6 resin containing 20% glass fiber, 15% milled glass. Added features of this grade include: Flame Retardant.
EUROPEASIAAMERICAS
RX00713H
LNP THERMOCOMP RX00713H compound is based on Nylon 6/6 resin containing 40% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
RX05494
LNP THERMOCOMP RX05494 compound is based on Nylon 6/6 resin containing 40% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
RX06420
LNP THERMOCOMP RX06420 compound is based on Nylon 6/6 resin containing 20% glass fiber. Added features of this grade include: Easy Molding, Low Extractables, Mold Release.
ASIAAMERICAS
RX06421S
LNP THERMOCOMP RX06421S is a compound based on Nylon 66 resin containing 30% Glass Fiber. Added features of this material include: Easy Molding, Heat Stabilized, Clean Compounding System.
EUROPEASIAAMERICAS
RX10405H
LNP THERMOCOMP RX10405H compound is based on Nylon 6/6 resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Healthcare.
EUROPEASIAAMERICAS
RX12402
LNP THERMOCOMP RX12402 compound is based on Nylon 6/6 resin containing 60% glass fiber. Added features of this grade include: Good Flow.
EUROPEASIAAMERICAS
RX98372H
LNP THERMOCOMP RX98372H compound is based on Nylon 6/6 resin containing 60% glass fiber. Added features of this grade include: Healthcare.
ASIAAMERICAS
RX99732C
LNP THERMOCOMP RX99732C compound is based on Nylon 6/6 resin containing 45% glass fibers.
EUROPEASIAAMERICAS
RYY33
LNP THERMOCOMP RYY33 compound is based on Nylon 6/6 resin containing 33% glass fiber.
EUROPEASIAAMERICAS
RZ006
LNP THERMOCOMP RZ006 compound is based on Nylon 6/6 resin containing 30% milled glass.
EUROPEASIAAMERICAS
RZ0069
LNP THERMOCOMP RZ0069 compound is based on Nylon 6/6 resin containing 30% milled glass. Added features of this grade include: Flame Retardant.
EUROPEASIAAMERICAS
RZ006S
LNP THERMOCOMP RZ006S compound is based on Nylon 6/6 resin containing 30% milled glass. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
RZ006SXP
LNP THERMOCOMP RZ006SXP compound is based on Nylon 6/6 resin containing 30% milled glass. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
SC004
LNP THERMOCOMP SC004 compound is based on Nylon 12 resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
SF006
LNP THERMOCOMP SF006 compound is based on Nylon 12 resin containing 30% glass fiber.
EUROPEASIAAMERICAS
SF008
LNP THERMOCOMP SF008 is a compound based on Nylon 12 resin containing 40% Glass Fiber.
EUROPEASIAAMERICAS
SF00A
LNP THERMOCOMP SF00A compound is based on Nylon 12 resin containing 50% glass fiber.
EUROPEASIAAMERICAS
TF002
LNP THERMOCOMP TF002 compound is based on Polyurethane (TPU) resin containing 10% glass fiber.
EUROPEASIAAMERICAS
TF006H
LNP THERMOCOMP TF006H is a compound based on Polyurethane (TPU) containing 30% Glass Fiber. Added features include: Healthcare
EUROPEASIAAMERICAS
UC006H
LNP THERMOCOMP UC006H compound is based on Polyphthalamide (PPA) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Healthcare.
EUROPEASIAAMERICAS
UC008H
LNP THERMOCOMP UC008H compound is based on Polyphthalamide (PPA) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Healthcare.
EUROPEASIAAMERICAS
UF003AS
LNP THERMOCOMP UF003AS compound is based on Polyphthalamide (PPA) resin containing 15% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
UF004AS
LNP THERMOCOMP UF004AS compound is based on Polyphthalamide (PPA) resin containing 20% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
UF0067V
LNP THERMOCOMP UF0067V compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, High Heat Resistance, SMT Process capable, Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
UF0067W
LNP THERMOCOMP UF0067W compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Hot Water Moldable, Non-Brominated & Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
UF0069S
LNP THERMOCOMP UF0069S compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Flame Retardant, Heat Stabilized.
EUROPEASIAAMERICAS
UF006AS
LNP THERMOCOMP UF006AS compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
UF006H
LNP THERMOCOMP UF006H compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
UF007SXC
LNP THERMOCOMP UF007SXC compound is based on Polyphthalamide (PPA) resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
UF008AR
LNP THERMOCOMP UF008AR compound is based on Polyphthalamide (PPA) resin, containing 40% glass fiber. Added features of this grade include: Mold Release.
EUROPEASIAAMERICAS
UF008AS
LNP THERMOCOMP UF008AS compound is based on Polyphthalamide (PPA) resin containing 40% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
UF008H
LNP THERMOCOMP UF008H compound is based on Polyphthalamide (PPA) resin containing 40% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
UF009S
LNP THERMOCOMP UF009S compound is based on Polyphthalamide (PPA) resin containing 45% glass fiber. Added features of this grade include: Heat Stabilized.
AMERICASASIAEUROPEGREATER CHINAMEA
UF00AAS
LNP THERMOCOMP UF00AAS compound is based on Polyphthalamide (PPA) resin containing 50% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
UF00ASW
LNP THERMOCOMP UF00ASW compound is based on Polyphthalamide (PPA) resin containing 50% glass fiber. Added features of this grade include: Heat Stabilized, Hot Water Moldable.
EUROPEASIAAMERICAS
UF00BAS
LNP THERMOCOMP UF00BAS compound is based on Polyphthalamide (PPA) resin containing 55% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
UFW49RSC
LNP THERMOCOMP UFW49RSC compound is based on Polyphthalamide (PPA) resin containing 45% glass fiber, 20% Wollastonite. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
UX04509H
LNP THERMOCOMP UX04509H compound is based on Polyphthalamide (PPA) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Healthcare.
EUROPEASIAAMERICAS
UX06028
LNP THERMOCOMP UX06028 compound is based on Polyphthalamide (PPA) resin containing 40% glass fiber. Added features of this grade include: Mold Release.
EUROPEASIAAMERICAS
UX06032
LNP THERMOCOMP UX06032 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Non-Brominated & Non-Chlorinated Flame Retardant, Heat Stabilized.
EUROPEASIAAMERICAS
UX08319
LNP THERMOCOMP UX08319 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Improved Dielectric Properties.
EUROPEASIAAMERICAS
UX08325
LNP THERMOCOMP UX08325 compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, SMT Process capable.
EUROPEASIAAMERICAS
VF008A
LNP THERMOCOMP VF008A compound is based on super tough Nylon 66 resin containing 40% glass fiber.
EUROPEASIAAMERICAS
WB004U
LNP THERMOCOMP WB004U is a compound based on Polybutylene Terephthalate (PBT) resin containing 20% Glass bead. Added features of this grade are: UV Stabilized.
EUROPEASIAAMERICAS
WB006
LNP THERMOCOMP WB006 compound is based on Polybutylene Terephthalate (PBT) resin containing 30% glass bead.
EUROPEAMERICAS
WC003
LNP THERMOCOMP WC003 compound is based on Polybutylene Terephthalate (PBT) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
WC006
LNP THERMOCOMP WC006 compound is based on Polybutylene Terephthalate (PBT) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
WF0039U
LNP THERMOCOMP WF0039U compound is based on Polybutylene Terephthalate (PBT) resin containing 15% glass fiber. Added features of this grade include: Flame Retardant and UV Stabilized.
EUROPEASIAAMERICAS
WF004
LNP THERMOCOMP WF004 compound is based on Polybutylene Terephthalate (PBT) resin containing 20% glass fiber.
EUROPEAMERICAS
WF0069
LNP THERMOCOMP WF0069 compound is based on Polybutylene Terephthalate (PBT) resin containing 30% glass fiber. Added features of this grade include: Flame Retardant.
EUROPEASIAAMERICAS
WF006H
LNP THERMOCOMP WF006H compound is based on Polybutylene Terephthalate (PBT) resin containing 30% glass fiber. Added features of this grade include: Healthcare.
EUROPEASIAAMERICAS
WF006V
LNP THERMOCOMP WF006V compound is based on Polybutylene Terephthalate (PBT) containing 30% glass fiber. This material has fast plating capability and stable RF performance. Added features of this grade include wide processing window and chemical resistance. It makes a good candidate for internal and external parts of Laser Direct Structuring (LDS) applications.
EUROPEASIAAMERICAS
WF006XXB
LNP THERMOCOMP WF006XXB compound is based on Polybutylene Terephthalate (PBT) resin containing 30% glass fiber. Added features of this grade include: Medium Flow, Healthcare, Low Extractables, Biocompatible (ISO10993 or USP Class VI).
EUROPEASIAAMERICAS
WF006XXL
LNP THERMOCOMP WF006XXL compound is based on Polybutylene Terephthalate (PBT) resin containing 30% glass fiber. Added features of this grade include: Good Mold Release, Heat Stabilized, Low Extractables.
EUROPE
WF006XXP
LNP THERMOCOMP WF006XXP compound is based on Polybutylene Terephthalate (PBT) resin containing 30% glass fiber.
EUROPEASIAAMERICAS
WF008
LNP THERMOCOMP WF008 compound is based on Polybutylene Terephthalate (PBT) resin containing 40% glass fiber.
ASIAAMERICAS
WFB62
LNP THERMOCOMP WFB62 compound is based on Polybutylene Terephthalate (PBT) resin containing 10% glass fiber, 30% glass bead. Added features of this grade include: Low Warpage.
EUROPEASIAAMERICAS
WFC06I
LNP THERMOCOMP COMPOUND WFC06I is a compound based on Polybutylene terephthalate (PBT) containing Glass Fiber. Added features of this material include Chemical Resistance, Enhanced Dimensional Stability, Low Warpage, Dielectrics, laser weldable.
EUROPEASIAAMERICAS
WFC06IXP
LNP THERMOCOMP COMPOUND WFC06IXP is a compound based on Polybutylene terephthalate (PBT) containing Glass Fiber. Added features of this material include Chemical Resistance, Enhanced Dimensional Stability, Low Warpage, Dielectrics.
EUROPEASIAAMERICAS
WX05456
LNP THERMOCOMP WX05456 compound is based on Polybutylene Terephthalate (PBT) resin containing mineral. Added features of this grade include: Low Warpage, Flame Retardant.
EUROPEASIAAMERICAS
WX05502
LNP THERMOCOMP WX05502 compound is based on Polybutylene Terephthalate (PBT) resin containing 45% glass fiber/mineral. Added features of this grade include: Flame Retardant.
EUROPEASIAAMERICAS
WX15003
LNP THERMOCOMP WX15003 compound is based on Polybutylene Terephthalate (PBT) resin containing 45 % glass fiber/mineral. Added features of this grade include: UV stabilized.
EUROPEASIAAMERICAS
WX15004L
LNP THERMOCOMP WX15004L is a compound based on Polybutylene Terephthalate + PET (PBT+PET) resin, containing 30% glass fiber. Added features of this material include: Mold Release, Heat Stabilizer. Material is suitable for food contact applications.
EUROPEASIAAMERICAS
WX88406
LNP THERMOCOMP WX88406 compound is based on Polybutylene Terephthalate (PBT) resin containing 25 % glass fiber.
EUROPEASIAAMERICAS
WX93111
LNP THERMOCOMP WX93111 compound is based on Polybutylene Terephthalate (PBT) resin containing 20% glass fiber. Added features of this grade include: : Improved CTI, Flame Retardant.
EUROPEASIAAMERICAS
WX96784
LNP THERMOCOMP WX96784 compound is based on Polybutylene Terephthalate (PBT) resin containing 25% mineral. Added features of this grade include: Improved CTI, Flame Retardant, Impact Modified.
EUROPEASIAAMERICAS
WZ002
LNP THERMOCOMP WZ002 compound is based on Polybutylene Terephthalate (PBT) resin containing 10% milled glass.
EUROPEASIAAMERICAS
XF006S
LNP THERMOCOMP XF006S compound is based on Amorphous Nylon resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
YF003S
LNP THERMOCOMP YF003S compound is based on Thermoplastic Polyester Elastomer (TPE) resin containing 15% glass fiber. Added features of this grade include: Heat Stabilized.
EUROPEASIAAMERICAS
YF004
LNP THERMOCOMP YF004 compound is based on Thermoplastic Polyester Elastomer (TPE) resin containing 20% glass fiber.
EUROPEASIAAMERICAS
YF005
LNP THERMOCOMP YF005 compound is based on Thermoplastic Polyester Elastomer (TPE) resin containing 25% glass fiber.
ASIAAMERICAS
YF006A
LNP THERMOCOMP YF006A compound is based on Thermoplastic Polyester Elastomer (TPE) resin containing 30% glass fiber.
EUROPEASIAAMERICAS
Z1C00
THERMOCOMP Z1C00 is an injection moldable compounds with ultra-low dielectric constant under wide frequencies, with other features including dimension stability, high HDT and low water uptake. Target industries are electronics and electrical including 5G applications.
ASIA
Z1C00I
LNP THERMOCOMP Z1C00I compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing proprietary fillers. Added features of this grade include: Ultra-Low Dielectric Constant and Loss Tangent, High HDT, Low Warpage, Excellent Surface Finishing and Chemical Resistant. It can also be Electro-less or Electro plated.
ASIA
Z1C00VI
LNP THERMOCOMP Z1C00VI compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing proprietary fillers. Added features of this grade include: Ultra-Low Dielectric Constant and Loss Tangent for Laser Direct Structuring (LDS), High HDT, Low Warpage, Excellent Surface Finishing and Chemical Resistant.
EUROPEASIAAMERICAS
ZF004
LNP THERMOCOMP ZF004 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% glass fiber.
EUROPEAMERICAS
ZF006
LNP THERMOCOMP ZF006 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 30% glass fiber.
EUROPEASIAAMERICAS
ZF0089
LNP THERMOCOMP ZF0089 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 40% glass fiber. Added features of this grade include: Exceptional Processing, Flame Retardant.
EUROPEASIAAMERICAS
ZFM3314
LNP THERMOCOMP ZFM3314 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% glass fiber. Added features of this grade include: Non-Brominated & Non-Chlorinated Flame Retardant, Impact Modified, Heat Stabilized.
EUROPEASIAAMERICAS
ZFM3314M
LNP THERMOCOMP ZFM3314M compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% glass fiber and minerals. Added features of this grade include: Non-Brominated & Non-Chlorinated Flame Retardant, Impact Modified, Heat Stabilized.
EUROPEASIAAMERICAS
ZFM62P
LNP THERMOCOMP ZFM62P compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 10% glass fiber, 30% mineral. Added features of this grade include: Exceptional Processing.
EUROPEASIAAMERICAS
ZKC04
LNP THERMOCOMP ZKC04 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% minerals and impact modifier. Added features of this grade include: High Dielectric Constant (Dk), Extremely Low Dissipation Factor (Df), Good Ductility and Good Thermal Performance.
EUROPEASIAAMERICAS
ZKC06
LNP THERMOCOMP ZKC06 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 30% minerals and impact modifier. Added features of this grade include: High Dielectric Constant (Dk), Extremely Low Dissipation Factor (Df), Good Ductility and Good Thermal Performance.
EUROPEASIAAMERICAS
ZKC08
LNP THERMOCOMP ZKC08 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 40% minerals and impact modifier. Added features of this grade include: High Dielectric Constant (Dk), Extremely Low Dissipation Factor (Df), Good Ductility and Good Thermal Performance,High Impact Resistance.
EUROPEASIAAMERICAS
ZKC09
LNP THERMOCOMP ZKC09 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing minerals and impact modifier. Added features of this grade include: High Dielectric Constant (Dk), Extremely Low Dissipation Factor (Df), and Good Thermal Performance.
EUROPEASIAAMERICAS
ZKC0CV
LNP THERMOCOMP ZKC0CV compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing proprietary fillers. Added features of this grade include: High Dielectric Constant (Dk), Low Dissipation Factor (Df) for Laser Direct Structuring (LDS) and Good Thermal Performance.
EUROPEASIAAMERICAS
ZKC0CXXD
LNP THERMOCOMP ZKC0CXXD compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing minerals and impact modifier. Added features of this grade include: High Dielectric Constant (Dk), Extremely Low Dissipation Factor (Df), and Good Thermal Performance.
EUROPEASIAAMERICAS
ZKC0DXXD
LNP THERMOCOMP ZKC0DXXD compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing minerals and impact modifier. Added features of this grade include: High Dielectric Constant (Dk), Extremely Low Dissipation Factor (Df), and Good Thermal Performance
EUROPEASIAAMERICAS
ZX06323
LNP THERMOCOMP ZX06323 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing proprietary fillers. Added features of this grade include: High Dielectric Constant and Low Loss Tangent
EUROPEASIAAMERICAS
ZX08005
LNP THERMOCOMP ZX08005 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing unreinforced. Added features of this grade include: Improved Dielectric Properties.
EUROPEASIAAMERICAS
ZX08309
LNP THERMOCOMP ZX08309 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing proprietary fillers. Added features of this grade include: High Dielectric Constant and Low Loss Tangent.
LNP™ STAT-LOY™ COMPOUND
Grades Available: 27
Available in: Europe, Asia, Americas, MEA, Global
GENERAL INFORMATION
DESCRIPTION
STAT-LOY™ alloy compounds combine an insulative base resin with an inherently conductive polymer to provide permanent anti-static performance. Stat-Loy compounds are non-sloughing and colorable.
Stat-Loy compounds offer cost-effective solutions when products for anti-stat applications are required.
BENEFITS
SOLUTIONS FOR APPLICATIONS
Provides antistatic properties, with surface resistivities ranging from 109 to 1012 ohms/sq. (where non-treated base resins exhibit 1014-1018 ohms/sq). Can suppress the development of a static charge created by relative movement between two parts. Effective independent of humidity levels, colorable, non-sloughing, and can be formulated for cost effectiveness. Many grades are also available as clean compound system (CCS) materials for applications requiring low levels of ionic contamination particularly designed for use in the disk drive industry.
ENHANCED STRENGTH
Reinforcements such as glass fiber can be added to further enhance the properties of Stat-Loy compounds.
COLORABILITY
Contains permanent anti-static additives rather than carbon additives, allowing their availability in a wide range of opaque, transparent, and clear custom colors and aesthetic effects.
DIMENSIONAL STABILITY
Exhibit excellent isotropic shrinkage for dimensional stability and low warpage.
FLAME RETARDANCY
Can be compounded for flame retardancy (FR), including non-halogenated FR compounds.
RESINS AND PROCESSING TYPES
Available in the following base resins: CYCOLAC resin and other acrylonitrile butadiene styrene (ABS) resins, VALOX resin and other polybutylene terephthalate (PBT) resins, polycarbonate/ABS (PC/ABS), polyamide (PA), polypropylene (PP), polyethylene (PE), and polyacetal (POM). Available in forms for extrusion, injection molding, thermoforming, blow molding, and rotational molding.
GRADES
GRADES AVAILABLE: 27 (Clear Filters)
LIST VIEW: Expanded Compact
Availablity:
ANY REGION
Industry(s):
SELECT
Application(s):
SELECT
Processing technique(s):
SELECT
63000CT
LNP STAT-LOY 63000CT compound is based on Polycarbonate / Polyester alloy containing proprietary additives targeted for advanced semiconductor packaging applications. Added features of this grade include: LNP Clean Compounding Technology, Permanently Anti-Static, Translucent.
EUROPEASIAAMERICAS
63000CTC
LNP STAT-LOY 63000CTC compound is based on Polycarbonate / Polyester alloy containing proprietary additives targeted for advanced semiconductor packaging applications. Added features of this grade include: LNP Clean Compounding Technology, Permanently Anti-Static, Translucent.
EUROPEASIAAMERICAS
63000CTU
LNP STAT-LOY 63000CTU compound is based on Polycarbonate / Polyester alloy containing proprietary additives targeted for advanced semiconductor packaging applications. Added features of this grade include: LNP Clean Compounding Technology, Permanently Anti-Static, , UV Stabilized, Translucent.
EUROPEASIAAMERICAS
93000LTH
LNP STAT-LOY 93000LTH compound is based on Acrylic resin containing proprietary additives. Added features of this grade include: Permanently Anti-Static, Transparent and Healthcare.
EUROPEASIAAMERICAS
9X03508
LNP STAT-LOY 9X03508 compound is based on Polyphenylene Ether (PPE) / Nylon 6/6 blend containing proprietary fillers and glass fiber. Added features of this grade include: Permanently Anti-Static, Flame Retardant, High Impact.
EUROPEASIAAMERICAS
A3000
LNP STAT-LOY A3000 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static.
EUROPEASIAAMERICAS
A30009
LNP STAT-LOY A30009 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Flame Retardant.
EUROPEASIAAMERICAS
A3000TXB
LNP STAT-LOY A3000TXB compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Transparent, Bio-assessed to ISO 10993, Besides healthcare, this material is also targeted for food contact applications (excluding Europe).
EUROPEASIAAMERICAS
A3000XXP
LNP STAT-LOY A3000XXP compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static.
AMERICASASIAEUROPEGREATER CHINAMEA
AF3009
LNP STAT-LOY AF3009 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 10% glass fiber. Added features of this grade include: Permanently Anti-Static, Flame Retardant.
EUROPEASIAAMERICAS
AX11421
LNP STAT-LOY AX11421 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static.
EUROPEASIAAMERICAS
D3000IEU6
LNP STAT-LOY D3000IEU6 compound is based on Polycarbonate (PC) Copolymer that has been designed towards ATEX compliant applications requiring antistatic. The material has an optimized balance between surface resistivity and impact strength retention after hydro aging, and has excellent low temperature impact. The material is available in a wide range of dark and light colors, including UV stabilization.
EUROPEASIAAMERICAS
K3000SZ
LNP STAT-LOY K3000SZ compound is based on POM (Acetal) copolymer resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Heat Stabilized.
EUROPEASIAAMERICAS
K3000Z
LNP STAT-LOY K3000Z compound is based on POM (Acetal) copolymer resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static.
EUROPEASIAAMERICAS
KX01002
LNP STAT-LOY KX01002 compound is based on POM (Acetal) copolymer resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static.
EUROPEASIAAMERICAS
KX09024
LNP STAT-LOY KX09024 compound is based on POM (Acetal) copolymer resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static.
EUROPEASIAAMERICAS
KX96821
LNP STAT-LOY KX96821 compound is based on POM (Acetal) copolymer resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static.
EUROPEASIAAMERICAS
M3000
LNP STAT-LOY M3000 compound is based on unfilled Polypropylene (PP) resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static.
EUROPEAMERICAS
M3000C
LNP STAT-LOY M3000C compound is based on unfilled Polypropylene (PP) resin containing proprietary fillers. Added features of this grade include: LNP Clean Compounding Technology, Permanently Anti-Static.
EUROPEASIAAMERICAS
N30009
LNP STAT-LOY N30009 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Flame Retardant.
EUROPEASIAAMERICAS
NX03583
LNP STAT-LOY NX03583 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Flame Retardant.
EUROPEASIAAMERICAS
NX13401
LNP STAT-LOY NX13401 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Flame Retardant, Excellent Mold Release.
EUROPEASIAAMERICAS
P3000U
LNP STAT-LOY P3000U compound is based on Nylon 6 resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, UV – Stabilized.
EUROPEASIAAMERICAS
PF303
LNP STAT-LOY PF303 compound is based on Nylon 6 resin containing 15% glass fiber. Added features of this grade include: Permanently Anti-Static.
ASIAAMERICAS
PF306
LNP STAT-LOY PF306 compound is based on Nylon 6 resin containing 30% glass fiber. Added features of this grade include: Permanently Anti-Static.
EUROPEASIAAMERICAS
W3000XXJ
LNP STAT-LOY W3000XXJ compound is based on Polybutylene Terephthalate (PBT) resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, Colorable, Healthcare, Low Extractables, Food Contact compliant.
EUROPEASIAAMERICAS
YX02589C
LNP STAT-LOY YX02589C compound is based on Polyester Elastomer resin containing proprietary fillers. Added features of this grade include: Permanently Anti-Static, LNP Clean Compounding Technology.
208 LNP™ STAT-KON™ COMPOUND
Grades Available: 208
Available in: Europe, Asia, Americas, MEA, Global, Greater China
GENERAL INFORMATION
DESCRIPTION
STAT-KON™ compounds contain electrically conductive additives that provide surface resistivity from antistatic, through conductive, to electromagnetic interference (EMI) shielding. Stat-Kon composites are rounded out by LNP’s STAT-LOY™ and FARADEX™ compounds to provide a full range of electrically active materials.
Stat-Kon compounds offer cost-effective solutions when products must avoid static electricity buildup or discharge.
BENEFITS
BROAD RANGE OF SURFACE RESISTIVITY
Wide range of surface resistivity, from 100 to 1012 ohms/sq. (where non-treated base resins exhibit 1014-1018 ohms/sq.) Applications range from statically dissipative to electrically conductive.
CHOICE OF CONDUCTIVE ADDITIVES
Can be formulated to meet specific needs with carbon fiber, stainless steel fiber, carbon powder, metal powder and flake, and migratory antistats. Depending on the electrically active filler or reinforcement, these compounds can suppress initial charges, minimize tribo charging from movement, insulate against leakage current, prevent electrostatic discharge to/from human contact, provide a grounding path for charge bleed-off.
FORMULATION BY APPLICATION
Can be fine-tuned for surface resistivity, volume resistivity, static decay, and other engineering parameters.
BROAD RANGE OF ATTRIBUTES
Broad range of mechanical, physical, and thermal properties depending on the base resin selected. The addition of other additives and reinforcements, including glass fiber, polytetrafluoroethylene (PTFE), and PTFE/silicone systems, further extend the properties. Many grades are also available as clean compound system (CCS) materials for applications requiring low levels of ionic contamination, particularly designed for the use in the disk drive industry.
DIMENSIONAL STABILITY
Exhibit excellent isotropic shrinkage for dimensional stability and low warpage.
FLAME RETARDANCY
Can be compounded for flame retardancy (FR), including non-halogenated FR compounds.
WIDE RANGE OF RESINS AND PROCESSING TYPES
Available in most major engineering thermoplastics and in forms for extrusion, injection molding, thermoforming, blow molding, and rotational molding. Some series accept colors and aesthetic effects, and Stat-Kon can be formulated for cost-effectiveness.
5E003M
LNP STAT-KON 5E003M compound is based on Polyvinylidene Fluoride (PVDF) resin containing 15% milled carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
9X02785
LNP STAT-KON 9X02785 compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) blend containing proprietary fillers. Added features of this grade include: Electrically Conductive.
ASIAAMERICAS
9X08403C
LNP STAT-KON 9X08403C compound is based on Liquid Crystal Polymer (LCP) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, High Temperature, Flame Retardant, Electrically Conductive, Good Barrier against water and oxygen.
EUROPEASIAAMERICAS
AE001
LNP STAT-KON AE001 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 7% carbon fiber. Added features of this grade include: Electrically Conductive
EUROPE
AE002
LNP STAT-KON AE002 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 10% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
AE003
LNP STAT-KON AE003 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEAMERICAS
AE004
LNP STAT-KON AE004 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
ASIAAMERICAS
AE006
LNP STAT-KON AE006 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
AE008XXY
LNP STAT-KON AE008XXY compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
AX02747
LNP STAT-KON AX02747 compound is based on Acrylonitrile Butadiene Styrene (ABS) resin containing carbon fiber. Added features of this grade include: Electrically Conductive.
ASIAAMERICAS
CD000
LNP STAT-KON CD000 compound is based on Polystyrene (PS) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
CD000I
LNP STAT-KON CD000I compound is based on Polystyrene (PS) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, High Impact.
ASIAAMERICAS
CX01039
LNP STAT-KON CX01039 compound is based on Polystyrene (PS) resin containing proprietary fillers. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DC10EPFR
LNP STAT-KON DC10EPFR compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Flame Retardant, Electrically Conductive, Exceptional Processing.
EUROPEASIAAMERICAS
DD000
LNP STAT-KON DD000 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DD0001
LNP STAT-KON DD0001 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
DD0001I
LNP STAT-KON DD0001I compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Non-Brominated, Non-Chlorinated Flame Retardant, High Impact, Electrically Conductive.
EUROPEASIAAMERICAS
DD0009
LNP STAT-KON DD0009 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Flame Retardant.
EUROPEASIAAMERICAS
DD0009E
LNP STAT-KON DD0009E compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Flame Retardant, Easy Molding.
ASIAAMERICAS
DD0009P
LNP STAT-KON DD0009P compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Exceptional Processing, Flame Retardant.
EUROPEASIAAMERICAS
DD0009PC
LNP STAT-KON DD0009PC compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Exceptional Processing, Flame Retardant.
EUROPEASIAAMERICAS
DD0009XP
LNP STAT-KON DD0009XP compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Flame Retardant.
ASIAAMERICAS
DD000P
LNP STAT-KON DD000P compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Exceptional Processing.
EUROPEASIAAMERICAS
DD000XI
LNP STAT-KON DD000XI compound is based on Polycarbonate (PC) resin containing conductive carbon powder that has been designed towards ATEX compliant applications . Added features of this grade include: Electrically Conductive, Improved Impact, Hydrolytic Stability.
EUROPEASIAAMERICAS
DD200C
LNP STAT-KON DD200C compound is based on Polycarbonate (PC) resin containing conductive carbon powder and proprietary lubricant. Added features of this grade include: LNP Clean Compounding Technology, Low LPC, Low Ionics, Low Outgassing, Electrically Conductive.
EUROPEASIAAMERICAS
DDF029
LNP STAT-KON DDF029 compound is based on Polycarbonate (PC) resin containing conductive carbon powder and 10% glass fiber. Added features of this grade include: Electrically Conductive, Flame Retardant.
EUROPEASIAAMERICAS
DE002
LNP STAT-KON DE002 compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DE0021E
LNP STAT-KON DE0021E compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Easy Molding, Non-Brominated, Non-Chlorinated Flame Retardant, Electrically Conductive.
EUROPEASIAAMERICAS
DE0026
LNP STAT-KON DE0026 compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Non-Brominated, Non-Chlorinated Flame Retardant, Electrically Conductive.
EUROPEASIAAMERICAS
DE0026E
LNP STAT-KON DE0026E compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Non-Halogenated Flame Retardant, Electrically Conductive, Easy Molding.
EUROPEASIAAMERICAS
DE0029
LNP STAT-KON DE0029 compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant.
EUROPEASIAAMERICAS
DE0029E
LNP STAT-KON DE0029E compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Flame Retardant, Electrically Conductive, Easy Molding.
EUROPEASIAAMERICAS
DE0029EC
LNP STAT-KON DE0029EC compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Flame Retardant, Electrically Conductive, Easy Molding.
EUROPEASIAAMERICAS
DE0029EF
LNP STAT-KON DE0029EF compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Flame Retardant, Electrically Conductive, Easy Molding.
EUROPEASIAAMERICAS
DE002ER
LNP STAT-KON DE002ER compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Easy Molding. Mold Release, Electrically Conductive.
EUROPEASIAAMERICAS
DE003
LNP STAT-KON DE003 compound is based on Polycarbonate (PC) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DE0039
LNP STAT-KON DE0039 compound is based on Polycarbonate (PC) resin containing 15% carbon fiber. Added features of this grade include: Flame Retardant. Electrically Conductive.
EUROPEASIAAMERICAS
DE003E
LNP STAT-KON DE003E compound is based on Polycarbonate (PC) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
EUROPEASIAAMERICAS
DE003ER
LNP STAT-KON DE003ER compound is based on Polycarbonate (PC) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Mold Release, Electrically Conductive.
EUROPEASIAAMERICAS
DE003P
LNP STAT-KON* DE003P is a compound based on Polycarbonate resin containing 15% Carbon Fiber. Added features of this material include: Electrically Conductive, Exceptional Processing.
EUROPEASIAAMERICAS
DE003Z
LNP STAT-KON DE003Z compound is based on Polycarbonate (PC) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive, Extrusion grade.
ASIAAMERICAS
DE004
LNP STAT-KON DE004 compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DE0049F
LNP STAT-KON DE0049F compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant, Superior Molding.
EUROPEASIAAMERICAS
DE0049P
LNP STAT-KON DE0049P compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant, Exceptional Processing.
EUROPEASIAAMERICAS
DE006
LNP STAT-KON DE006 compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DE0069F
LNP STAT-KON DE0069F compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant, Superior Molding.
ASIAAMERICAS
DE006ER
LNP STAT-KON DE006ER compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: Easy Molding. Mold Release, Electrically Conductive.
EUROPEASIAAMERICAS
DEF13
LNP STAT-KON DEF13 compound is based on Polycarbonate (PC) resin containing 5% glass fiber and 15% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DEF42
LNP STAT-KON DEF42 compound is based on Polycarbonate (PC) resin containing 20% glass fiber, 10% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DEI13F
LNP STAT-KON DEI13F compound is based on Polycarbonate (PC) resin containing 15% carbon fiber, 2% silicone. Added features of this grade include: Electrically Conductive, Superior Molding, Wear Resistant.
EUROPEASIAAMERICAS
DEL139P
LNP STAT-KON DEL139P compound is based on Polycarbonate (PC) resin containing 15% carbon fiber, 5% PTFE. Added features of this grade include: Electrically Conductive, Exceptional Processing, Flame Retardant, Wear Resistant.
EUROPEASIAAMERICAS
DEL13EXC
LNP STAT-KON DEL13EXC compound is based on Polycarbonate (PC) resin containing 15% carbon fiber, 5% PTFE. Added features of this grade include: Easy Molding, Electrically Conductive, Wear Resistant.
ASIAAMERICAS
DEL13PXC
LNP STAT-KON DEL13PXC compound is based on Polycarbonate (PC) resin containing 5% PTFE, 15% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, Wear Resistant.
EUROPEASIAAMERICAS
DEL22P
LNP STAT-KON DEL22P compound is based on Polycarbonate (PC) resin containing 10% carbon fiber, 10% PTFE. Added features of this grade include: Electrically Conductive. Exceptional Processing, Wear Resistant.
EUROPEASIAAMERICAS
DEL329E
LNP STAT-KON DEL329E compound is based on Polycarbonate (PC) resin containing 10% carbon fiber, 15% PTFE. Added features of this grade include: Electrically Conductive, Flame Retardant, Wear Resistant, Easy Molding.
AMERICAS
DEL329EP
LNP STAT-KON DEL329EP compound is based on Polycarbonate (PC) resin containing 10% carbon fiber, 15% PTFE, Flame Retardant. Added features of this grade include: Electrically Conductive, Internally Lubricated, Flame Retardant, Wear Resistant.
EUROPEASIAAMERICAS
DEL329XF
LNP STAT-KON DEL329XF compound is based on Polycarbonate (PC) resin containing 10% carbon fiber, 15% PTFE. Added features of this grade include: Electrically Conductive. Wear Resistant, Flame Retardant.
EUROPEASIAAMERICAS
DEL32P
LNP STAT-KON DEL32P compound is based on Polycarbonate (PC) resin containing 10% carbon fiber,15% PTFE. Added features of this grade include: Internally Lubricated, Electrically Conductive, Wear Resistant, Exceptional Processing.
EUROPEASIAAMERICAS
DEL339XF
LNP STAT-KON DEL339XF compound is based on Polycarbonate (PC) resin containing 15% carbon fiber, 15% PTFE. Added features of this grade include: Electrically Conductive, Flame Retardant, Wear Resistant, Superior Molding.
EUROPEASIAAMERICAS
DEL33EC
LNP STAT-KON DEL33EC compound is based on Polycarbonate (PC) resin containing 15% carbon fiber, 15% PTFE. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Wear Resistant, Easy Molding.
EUROPEASIAAMERICAS
DEL34
LNP STAT-KON DEL34 compound is based on Polycarbonate (PC) resin containing 15% PTFE, 20% carbon fiber. Added features of this grade include: Electrically Conductive, Wear Resistant.
EUROPEASIAAMERICAS
DEL34E
LNP LUBRICOMP DEL34E compound is based on Polycarbonate (PC) resin containing 15% PTFE, 20% carbon fiber. Added features of this grade include: Wear Resistant, Electrically Conductive.
EUROPEASIAAMERICAS
DEL36
LNP STAT-KON DEL36 compound is based on Polycarbonate (PC) resin containing 30% carbon fiber, 15% PTFE. Added features of this grade include: Electrically Conductive, Wear Resistant.
EUROPEASIAAMERICAS
DEL36P
LNP STAT-KON DEL36P compound is based on Polycarbonate (PC) resin containing 30% carbon fiber, 15% PTFE. Added features of this grade include: Internally Lubricated, Exceptional Processing, Electrically Conductive, Wear Resistant.
EUROPEASIAAMERICAS
DEP23FXC
LNP STAT-KON DEP23FXC compound is based on Polycarbonate (PC) resin containing 15% carbon fiber, 10% PTFE/silicone. Added features of this grade include: Electrically Conductive. Wear Resistant, Superior Molding.
EUROPEASIAAMERICAS
DEP32
LNP STAT-KON DEP32 compound is based on Polycarbonate (PC) resin containing 10% carbon fiber, 15% PTFE/silicone. Added features of this grade include: Electrically Conductive, Wear Resistant.
EUROPEAMERICAS
DFD029
LNP STAT-KON DFD029 compound is based on Polycarbonate (PC) resin containing conductive carbon powder and 10% glass fiber. Added features of this grade include: Electrically Conductive, Flame Retardant.
EUROPEASIAAMERICAS
DJ000I
LNP STAT-KON DJ000I is a compound based on PC resin containing Proprietary Filler(s). Added features of this material include: Electrically Conductive.
EUROPE
DJ000ICX4
LNP STAT-KONTM DJ000ICX4 is a static dissipative compound based on Polycarbonate (PC) and Carbon Nano Tube. Added features of this grade include Electrically Conductive, Improved Processing.
AMERICASASIAEUROPEGREATER CHINAMEA
DJ000IXX3
LNP STAT-KON DJ000IXX3 is a static dissipative CNT compound based on Polycarbonate Copolymer, having an outstanding low temperature impact strength combined with excellent processing properties. This material has a fit in a broad range of markets, including electronics, mobility and industrial.
EUROPEASIAAMERICAS
DSL229
LNP STAT-KON DSL229 compound is based on Polycarbonate (PC) resin containing 10% PTFE, 10% stainless steel fiber. Added features of this grade include: Electrically Conductive, Wear Resistant, Flame Retardant.
EUROPEASIAAMERICAS
DX02437
LNP STAT-KON DX02437 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Impact Modified.
EUROPEASIAAMERICAS
DX02728C
LNP STAT-KON DX02728C compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.
EUROPEASIAAMERICAS
DX03550
LNP STAT-KON DX03550 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DX03571
LNP STAT-KON DX03571 compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Electrically Conductive, Impact Modified.
EUROPEASIAAMERICAS
DX04403
LNP STAT-KON DX04403 compound is based on Polycarbonate (PC) resin containing 8% carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant.
EUROPEASIAAMERICAS
DX04489C
LNP STAT-KON DX04489C compound is based on Polycarbonate (PC) resin containing 30% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, High Modulus, Electrically Conductive.
EUROPEASIAAMERICAS
DX04490R
LNP STAT-KON DX04490R compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Electrically Conductive, Radar Absorbing.
EUROPEASIAAMERICAS
DX05042
LNP STAT-KON DX05042 compound is based on Polycarbonate (PC) resin containing 10% PTFE, 20% carbon fiber, 5% glass fiber. Added features of this grade include: Electrically Conductive, Wear Resistant, Easy Molding.
EUROPEASIAAMERICAS
DX05301C
LNP STAT-KON DX05301C compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: LNP Clean Compounding Technology, Low Ionic, Low Outgassing, Low LPC and Electrically Conductive.
EUROPEASIAAMERICAS
DX05305C
LNP STAT-KON DX05305C compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: LNP Clean Compounding Technology, Low Ionic, Low Outgassing, Low LPC and Electrically Conductive.
EUROPEASIAAMERICAS
DX05474
LNP STAT-KON DX05474 compound is based on Polycarbonate (PC) resin containing 10% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding, Flame Retardant, Mold Release.
EUROPEASIAAMERICAS
DX05499
LNP STAT-KON DX05499 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Flame Retardant.
EUROPEASIAAMERICAS
DX07323
LNP STAT-KON DX07323 compound is based on Polycarbonate (PC) resin containing stainless steel fiber. Added features of this grade include: Electrically Conductive, Impact Modified, meet ATEX requirements.
EUROPEASIAAMERICAS
DX09301C
LNP STAT-KON DX09301C compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: LNP Clean Compounding Technology, Low LPC, Low Ionics, Low Outgassing, Electrically Conductive.
EUROPEASIAAMERICAS
DX09303C
LNP STAT-KON DX09303C compound is based on Polycarbonate (PC) resin containing 35% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low LPC, Low Ionics, Low Outgassing, Low C18-C40 Hydrocarbons, Electrically Conductive, High Modulus, Good Flow.
EUROPEASIAAMERICAS
DX09315C
LNP STAT-KON DX09315C compound is based on Polycarbonate (PC) resin containing 15% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low LPC, Low Ionics, Low Outgassing, Low C18-C40 Hydrocarbons, Electrically Conductive.
EUROPEASIAAMERICAS
DX10315C
LNP STAT-KON DX10315C compound is based on Polycarbonate (PC) resin containing 15% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low LPC, Low Ionics, Low Outgassing, Low C18-C40 Hydrocarbons, Electrically Conductive.
EUROPEASIAAMERICAS
DX11408
LNP STAT-KON DX11408 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Improved Ductility, meet ATEX requirements.
EUROPEASIAAMERICAS
DX11411R
LNP STAT-KON DX11411R compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Electrically Conductive, Radar Absorbing.
EUROPEASIAAMERICAS
DX12411C
LNP STAT-KON DX12411C compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Impact Modified, LNP Clean Compounding Technology.
EUROPEASIAAMERICAS
DX13301C
LNP STAT-KON DX13301C compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Electrically Conductive, LNP Clean Compounding Technology.
EUROPEASIAAMERICAS
DX13315C
LNP STAT-KON DX13315C compound is based on Polycarbonate (PC) resin containing 15% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low LPC, Low Ionics, Low Outgassing, Low C18-C40 Hydrocarbons, Electrically Conductive.
EUROPEASIAAMERICAS
DX13320C
LNP STAT-KON DX13320C compound is based on Polycarbonate (PC) resin containing 20% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low LPC, Low Ionics, Low Outgassing, Low C18-C40 Hydrocarbons, Electrically Conductive.
EUROPEASIAAMERICAS
DX89795
LNP STAT-KON DX89795 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DX91077
LNP STAT-KON DX91077 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DX95523C
LNP STAT-KON DX95523C compound is based on Polycarbonate (PC) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability.
EUROPEASIAAMERICAS
DX96573C
LNP STAT-KON DX96573C compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, LNP Clean Compounding Technology.
EUROPEASIAAMERICAS
DX96717C
LNP STAT-KON DX96717C compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Flame Retardant.
EUROPEASIAAMERICAS
DX98477
LNP STAT-KON DX98477 compound is based on Polycarbonate (PC) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
DX99873C
LNP STAT-KON DX99873C compound is based on Polycarbonate (PC) resin containing 25% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, High Flow, Dimensional Stability.
EUROPEASIAAMERICAS
EE003XXC
LNP STAT-KON EE003XXC compound is based on Polyetherimide (PEI) resin containing 15% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.
EUROPEASIAAMERICAS
EE004
LNP STAT-KON EE004 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
EE005E
LNP STAT-KON EE005E compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
ASIAAMERICAS
EEF42
LNP STAT-KON EEF42 compound is based on Polyetherimide (PEI) resin containing 10% carbon fiber, 20% glass fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
EJ000C
LNP STAT-KON* EJ000C is a static dissipative compound based on Polyetherimide (PEI) resin containing carbon nanotubes. Added features of this grade include: LNP Clean Compounding Technology, Dimensional Stability. This material has a fit in broad range of markets including the semiconductor industry (e.g. HDD parts).
AMERICASASIAEUROPEGREATER CHINAMEA
EX01407C
LNP STAT-KON EX01407C compound is based on Polyetherimide (PEI) resin containing carbon fiber and PTFE. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.
EUROPEASIAAMERICAS
EX02598C
LNP STAT-KON EX02598C compound is based on Polyetherimide (PEI) resin containing carbon nanotube. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.
EUROPEASIAAMERICAS
EX03319C
LNP STAT-KON EX03319C compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low Non-Volatile Residue (NVR), Electrically Conductive
EUROPEASIAAMERICAS
EX07311P
LNP STAT-KON EX07311P compound is based on Polyetherimide (PEI) resin containing carbon fiber (15%), glass fiber (25%) and PTFE. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability, Wear Resistant.
EUROPEASIAAMERICAS
EX11318C
LNP STAT-KON EX11318C compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low C18-C40 Hydrocarbons, Electrically Conductive, Dimensional Stability.
EUROPEASIAAMERICAS
EX11402R
LNP STAT-KON EX11402R compound is based on Polyetherimide (PEI) resin containing proprietary fillers. Added features of this grade include: Electrically Conductive, Radar Absorbing.
EUROPEASIAAMERICAS
EX12310C
LNP STAT-KON EX12310C compound is based on Polyetherimide (PEI) resin containing 10% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low C18-C40 Hydrocarbons, Electrically Conductive, Dimensional Stability.
EUROPEASIAAMERICAS
EX99689C
LNP STAT-KON EX99689C compound is based on Polyetherimide (PEI) resin containing 10% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.
EUROPEASIAAMERICAS
FD000
LNP STAT-KON FD000 compound is based on Polyethylene (PE) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
FX09905
LNP STAT-KON FX09905 compound is based on Polyethylene (PE) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
FX91304
LNP STAT-KON FX91304 compound is based on Polyethylene (PE) resin containing carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
FX98500C
LNP STAT-KON FX98500C compound is based on Polyethylene (PE) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
FX98501
LNP STAT-KON FX98501 compound is based on Polyethylene (PE) resin containing conductive carbon powder and glass fiber. Added features of this grade include: Electrically Conductive.
ASIAAMERICAS
IS000XXL
LNP STAT-KON IS000XXL compound is based on Nylon 6/12 resin containing stainless steel fiber. Added features of this grade include: Food Contact Compliant, Metal Detectable, Electrically Conductive.
EUROPEASIAAMERICAS
JK800
LNP STAT-KON JK800 compound is based on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend containing 8% carbon fiber. Added features of this grade include: Electrically Conductive, Good Hydrolytic Stability, Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
JX89626
LNP STAT-KON JX89626 compound is based on Polyethersulfone (PES) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
KD000
LNP STAT-KON KD000 compound is based on POM (Acetal) copolymer resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
KD000EI
LNP STAT-KON KD000EI compound is based on POM (Acetal) copolymer resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Impact Modified, Easy Molding.
EUROPEASIAAMERICAS
KDF20G
LNP STAT-KON KDF20G compound is based on POM (Acetal) copolymer resin containing conductive carbon powder and glass fiber. Added features of this grade include: Low Warpage, Electrically Conductive.
EUROPE
KE002
LNP STAT-KON KE002 compound is based on POM (Acetal) copolymer resin containing 10% Carbon Fiber. Added feature of this material is: Electrically Conductive.
EUROPEASIAAMERICAS
KE004
LNP STAT-KON KE004 compound is based on POM (Acetal) copolymer resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
KE005
LNP STAT-KON KE005 compound is based on POM (Acetal) copolymer resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
KEL22A
LNP STAT-KON KEL22A compound is based on Acetal Homopolymer (POM) resin containing 10% carbon fiber, 10% PTFE. Added features of this grade include: Electrically Conductive, Internally Lubricated, Wear Resistant.
EUROPEASIAAMERICAS
KEL32
LNP STAT-KON KEL32 compound is based on Acetal Copolymer (POM) resin containing 10% carbon fiber, 15% PTFE. Added features of this grade include: Electrically Conductive, Internally Lubricated, Wear Resistant.
EUROPEASIAAMERICAS
KEP33
LNP STAT-KON KEP33 compound is based on POM (Acetal) copolymer resin containing 15% carbon fiber, 15% PTFE/silicone. Added features of this grade include: Electrically Conductive, Wear Resistant.
EUROPEASIAAMERICAS
KS000MXL
LNP STAT-KON KS000MXL compound is based on POM (Acetal) copolymer resin containing stainless steel fiber. Added features of this grade include: Low Extractables, Metal Detectable, Electrically Conductive.
EUROPEASIAAMERICAS
KX02764
LNP STAT-KON KX02764 compound is based on POM (Acetal) copolymer resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
LX00486C
LNP STAT-KON LX00486C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability.
EUROPEASIAAMERICAS
LX00797C
LNP STAT-KON LX00797C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability.
EUROPEASIAAMERICAS
LX04420C
LNP STAT-KON LX04420C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability.
EUROPEASIAAMERICAS
MD000
LNP STAT-KON MD000 compound is based on Polypropylene (PP) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
MD000I
LNP STAT-KON MD000I compound is based on Polypropylene (PP) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, High Impact.
EUROPEASIAAMERICAS
MD000IS
LNP STAT-KON MD000IS compound is based on Polypropylene (PP) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, High Impact, Heat Stabilized.
EUROPEASIAAMERICAS
MD000ISC
LNP STAT-KON MD000ISC compound is based on Polypropylene (PP) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, High Impact, Heat Stabilized.
EUROPEASIAAMERICAS
ME003S
LNP STAT-KON ME003S compound is based on Polypropylene (PP) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive, Heat Stabilized.
ASIAAMERICAS
ME006
LNP STAT-KON ME006 compound is based on Polypropylene (PP) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
ASIAAMERICAS
MFD02
LNP STAT-KON MFD02 compound is based on Polypropylene (PP) resin containing conductive carbon powder and 10% glass fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
MFD03
LNP STAT-KON MFD03 compound is based on Polypropylene (PP) resin containing conductive carbon powder and 15% glass fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
MX01767C
LNP STAT-KON MX01767C compound is based on Polypropylene (PP) resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, LNP Clean Compounding Technology.
EUROPEASIAAMERICAS
OE002
LNP STAT-KON OE002 compound is based on Polyphenylene Sulfide (PPS) linear resin containing 10% carbon fiber. Added features of this grade include: Electrically Conductive.
ASIAAMERICAS
OE004A
LNP STAT-KON OE004A compound is based on Polyphenylene Sulfide (PPS) branched resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
OE004AE
LNP STAT-KON OE004AE compound is based on Polyphenylene Sulfide (PPS) branched resin containing 20% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
EUROPEASIAAMERICAS
OE006A
LNP STAT-KON OE006A compound is based on Polyphenylene Sulfide (PPS) branched resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
OE006C1
LNP STAT-KON OE006C1 compound is based on Polyphenylene Sulfide (PPS) linear resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
OE008A
LNP STAT-KON OE008A compound is based on Polyphenylene Sulfide (PPS) branched resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
OEL36A
LNP STAT-KON OEL36A compound is based on Polyphenylene Sulfide (PPS) branched resin containing 15% PTFE, 30% carbon fiber. Added features of this grade include: Wear Resistant, Electrically Conductive.
ASIAAMERICAS
OEP32
LNP STAT-KON OEP32 compound is based on Polyphenylene Sulfide (PPS) linear resin containing 10% carbon fiber, 15% PTFE/silicone. Added features of this grade include: Electrically Conductive, Wear Resistant.
ASIAAMERICAS
OX92182
LNP STAT-KON OX92182 compound is based on Polyphenylene Sulfide (PPS) branched resin containing glass fiber, carbon fiber and mineral. Added features of this grade include: Electrically Conductive Dimensional Stability.
EUROPEASIAAMERICAS
PD000
LNP STAT-KON PD000 compound is based on Nylon 6 resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
PFD04ES
LNP STAT-KON PFD04ES compound is based on Nylon 6 resin containing conductive carbon powder and 20%, glass fiber. Added features of this grade include: Electrically Conductive, Easy Molding, Heat Stabilized.
EUROPEASIAAMERICAS
PFD04S
LNP STAT-KON PFD04S compound is based on Nylon 6 resin containing conductive carbon powder and 20%, glass fiber. Added features of this grade include: Electrically Conductive, Heat Stabilized.
EUROPEASIAAMERICAS
PFD06
LNP STAT-KON PFD06 compound is based on Nylon 6 resin containing conductive carbon powder and 30% glass fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
PX05047
LNP STAT-KON PX05047 compound is based on Nylon 6 resin containing carbon fiber and glass fiber. Added features of this grade include: Electrically Conductive, High Impact, Heat Stabilized.
EUROPEASIAAMERICAS
PX08019
LNP STAT-KON PX08019 compound is based on Nylon 6 resin containing carbon fiber and glass fiber. Added features of this grade include: Electrically Conductive, Non-Halogenated Flame Retardant.
EUROPEASIAAMERICAS
PX09011
LNP STAT-KON PX09011 compound is based on Nylon 6 resin containing conductive carbon powder, glass fiber. Added features of this grade include: Electrically Conductive, Easy Molding, Heat Stabilized.
EUROPEASIAAMERICAS
PX11002
LNP STAT-KON PX11002 compound is based on Nylon 6 resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, Impact Modified, Flame Retardant.
EUROPEASIAAMERICAS
PX93058
LNP STAT-KON PX93058 compound is based on Nylon 6 resin containing conductive carbon powder and 20% glass fiber. Added features of this grade include: Electrically Conductive, Easy Molding, Impact Modified.
EUROPEASIAAMERICAS
QD000I
LNP STAT-KON QD000I compound is based on Nylon 6/10 resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, High Impact.
EUROPEASIAAMERICAS
RD000
LNP STAT-KON RD000 compound is based on Nylon 6/6 resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
RD000I
LNP STAT-KON RD000I compound is based on Nylon 6/6 resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, High Impact.
ASIAAMERICAS
RE002
LNP STAT-KON RE002 compound is based on Nylon 6/6 resin containing 10% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
RE0029
LNP STAT-KON RE0029 compound is based on Nylon 6/6 resin containing 10% carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant.
EUROPEASIAAMERICAS
RE003
LNP STAT-KON RE003 compound is based on Nylon 6/6 resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEAMERICAS
RE0039
LNP STAT-KON RE0039 compound is based on Nylon 6/6 resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant.
EUROPEASIAAMERICAS
RE004
LNP STAT-KON RE004 compound is based on Nylon 6/6 resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEAMERICAS
RE006
LNP STAT-KON RE006 compound is based on Nylon 6/6 resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
ASIAAMERICAS
RE0069S
LNP STAT-KON RE0069S compound is based on Nylon 6/6 resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant, Heat Stabilized.
ASIAAMERICAS
RE007
LNP STAT-KON RE007 compound is based on Nylon 6/6 resin containing 35% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
RE008
LNP STAT-KON RE008 compound is based on Nylon 6/6 resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
REF42I
LNP STAT-KON REF42I compound is based on Nylon 6/6 resin containing 10% carbon fiber and 20% glass fiber. Added features of this grade include: Electrically Conductive, Impact Modified.
EUROPEASIAAMERICAS
REF42XXP
LNP STAT-KON REF42XXP compound is based on Nylon 6/6 resin containing 20% glass fiber and 10% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
REL33
LNP STAT-KON REL33 compound is based on Nylon 6/6 resin containing 15% carbon fiber, 15% PTFE. Added features of this grade include: Electrically Conductive, Wear Resistant.
EUROPEASIAAMERICAS
REL42
LNP STAT-KON REL42 compound is based on Nylon 6/6 resin containing 20% PTFE, 10% carbon fiber. Added features of this grade include: Electrically Conductive, Internally Lubricated, Wear Resistant.
EUROPEASIAAMERICAS
RFD03
LNP STAT-KON RFD03 compound is based on Nylon 6/6 resin containing conductive carbon powder and 15% glass fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
RFD04
LNP STAT-KON* RFD04 is a compound based on Nylon 66 resin containing 20% Glass Fiber. Added features of this material include: Electrically Conductive.
EUROPEASIAAMERICAS
RX04031
LNP STAT-KON RX04031 compound is based on Nylon 6/6 resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Electrically Conductive, Non-Brominated & Non-Chlorinated Flame Retardant, Easy Molding.
EUROPEASIAAMERICAS
RX05488
LNP STAT-KON RX05488 compound is based on Nylon 6/6 resin containing carbon fiber, glass fiber, PTFE. Added features of this grade include: Electrically Conductive, Flame Retardant, Wear Resistant.
EUROPEASIAAMERICAS
RX05489
LNP STAT-KON RX05489 compound is based on Nylon 6/6 resin containing 10% carbon fiber, 20% glass fiber, 15% PTFE/silicone. Added features of this grade include: Electrically Conductive, Wear Resistant.
ASIAAMERICAS
RX08408
LNP STAT-KON RX08404 compound is based on Nylon 6/6 resin containing conductive carbon powder. Added features of this grade include: Electrically Conductive, High Impact.
EUROPEASIAAMERICAS
RX10004
LNP STAT-KON RX10004 compound is based on Nylon 6/6 resin containing carbon fiber and 40% glass fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
EUROPEASIAAMERICAS
SX90398
LNP STAT-KON SX90398 compound is based on Nylon 12 resin containing stainless steel fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
TX06488
LNP STAT-KON TX06488 compound is based on Polyurethane (TPU) resin containing conductive carbon powder. Added features of this grade include: Excellent Ductility, Electrically Conductive.
EUROPEASIAAMERICAS
UC1200
LNP STAT-KON UC1200 compound is based on Polyetherimide (PEI) resin containing 12% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
UEF26AS
LNP STAT-KON UEF26AS compound is based on Polyphthalamide (PPA) resin containing 10% glass fiber and 30% carbon fiber. Added features of this grade include: Electrically Conductive, Heat Stabilized.
EUROPEASIAAMERICAS
WD000
LNP STAT-KON WD000 compound is based on Polybutylene Terephthalate (PBT) resin containing proprietary fillers. Added features of this grade include: Electrically Conductive, Radar Absorbing
EUROPEASIAAMERICAS
WDF40
LNP STAT-KON WDF40 compound is based on Polybutylene Terephthalate (PBT) resin containing 20% glass fibers and proprietary fillers. Added features for this grade include: Electrically Conductive, Radar Absorbing.
EUROPEASIAAMERICAS
WDF40RID
LNP STAT-KON WDF40RID compound is based on Polybutylene Terephthalate (PBT) resin based containing 20% glass fibers and proprietary fillers. Added features for this grade include: Electrically Conductive, Radar Absorbing, higher flowability, and better warpage control.
EUROPEASIAAMERICAS
WE003ER
LNP STAT-KON WE003ER compound is based on Polybutylene Terephthalate (PBT) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Easy Release, Electrically Conductive.
EUROPEASIAAMERICAS
WEF42I
LNP STAT-KON WEF42I compound is based on Polybutylene Terephthalate (PBT) resin containing 10% carbon fiber, 20% glass fiber. Added features of this grade include: High Impact, Electrically Conductive.
EUROPEASIAAMERICAS
WEF42ISP
LNP STAT-KON WEF42ISP compound is based on Polybutylene Terephthalate (PBT) resin containing 20% glass fiber and 10% carbon fiber. Added features of this grade include: High Impact, Heat Stabilized and Electrically Conductive.
EUROPEASIAAMERICAS
WX06322
LNP STAT-KON WX06322 compound is based on Polybutylene Terephthalate (PBT) resin containing glass fiber and carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant, Low Warpage.
EUROPEASIAAMERICAS
WX11322
LNP STAT-KON WX11322 compound is based on Polybutylene Terephthalate (PBT) resin containing glass fiber and carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant, Low Warpage.
EUROPEASIAAMERICAS
ZD000XXR
LNP STAT-KON ZD000XXR compound is based on Polyphenylene Ether/Polystyrene (PPE/PS) blend which is electrically conductive with improved toughness and reduced carbon sloughing. This is targeted for applications like IC trays and packaging for semi-conductor industry.
EUROPEASIAAMERICAS
ZE002
LNP STAT-KON ZE002 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 10% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
ZE0039
LNP STAT-KON ZE0039 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 15% carbon fiber. Added features of this grade include: Electrically Conductive , Flame Retardant.
EUROPEASIAAMERICAS
ZE004
LNP STAT-KON ZE004 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
ZE004XXQ
LNP STAT-KON ZE004XXQ compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
ZEF061XC
LNP STAT-KON ZEF061XC compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% glass fiber, 10% milled carbon fiber. Added features of this grade include: Electrically Conductive, Flame Retardant.
EUROPEASIAAMERICAS
ZEL34XXC
LNP STAT-KON ZEL34XXC compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 20% carbon fiber, 15% PTFE. Added features of this grade include: : Electrically Conductive , Internally Lubricated, Wear Resistant.
EUROPEASIAAMERICAS
ZJK20I
LNP STAT-KON ZJK20I is a static dissipative CNT compound based on polyphenylene ether (PPE) + polystyrene (PS) resin with low particulate count and good high heat properties. This material is an excellent candidate for IC tray, Wafer cassette and Slider tray parts in the semiconductor industry.
EUROPEASIAAMERICAS
ZX05009
LNP STAT-KON ZX05009 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing 18% carbon fiber. Added features of this grade include: Electrically Conductive.
EUROPEASIAAMERICAS
ZX05043
LNP STAT-KON ZX05043 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing glass fiber, PTFE, carbon fiber. Added features of this grade include: Electrically Conductive, Internally Lubricated, Wear Resistant.
35 LNP™ LUBRILOY™ COMPOUND
Grades Available: 35
Available in: Asia, Americas, Europe, MEA, Global, Greater China
GENERAL INFORMATION
DESCRIPTION
LUBRILOY alloy compounds provide lubrication through a unique, patented lubrication technology. Lubriloy compounds offer cost-effective wear and friction performance d to conventional polytetrafluoroethylene (PTFE) lubricants.
Lubriloy compounds feature high impact and toughness and are used in a broad variety of demanding automotive, office equipment, electronics, and appliance applications.
BENEFITS
WEAR AND FRICTION PERFORMANCE
Provide a broad range of lubricity through a unique, patented lubricant technology. Lubriloy compounds significantly reduce friction and wear rates of plastic parts moving over other surfaces, whether contact is plastic-on-metal or plastic-on-plastic. They also extend product life and reduce or eliminate squeaks and other noise from moving parts.
RANGE OF ENGINEERING THERMOPLASTICS
Available in five commonly used resins: LEXAN resin and other polycarbonate (PC) resins, NORYL polyphenylene oxide (PPO) resins, polyacetal (POM), polyamide 6,6 (PA 66), and polyphthalamide (PPA).
BROAD RANGE OF PROPERTIES
Additional lubricants and reinforcements can also be added to Lubriloy compounds, such as glass, aramid, PTFE, and stainless steel to enhance wear, friction, cost, abrasion resistance, mechanical strength, stiffness, and conductivity.
FLAME RETARDANCY
Can be compounded for flame retardancy (FR), including non-halogenated FR compounds.
COLORABILITY
Available in a wide range of opaque colors.
HELPS CONTROL COST
Can help eliminate costly secondary lubricating operations, plus they offer the general benefits of injection molding, including greater design freedom, part consolidation, and improved production economies.
D2000
LNP LUBRILOY D2000 compound is based on Polycarbonate (PC) resin containing a proprietary non-halogenated lubrication system. Added features of this grade include: Wear Resistant.
ASIAAMERICAS
D20001
LNP LUBRILOY D20001 compound is based on Polycarbonate (PC) resin containing proprietary lubricant. Added features of this grade include: Non-Brominated, Non-Chlorinated Flame Retardant, Wear Resistant.
EUROPEASIAAMERICAS
D20009
LNP LUBRILOY D20009 compound is based on Polycarbonate (PC) resin containing proprietary lubricant. Added features of this grade include: Flame Retardant, Wear Resistant.
ASIAAMERICAS
D2000AXH
LNP LUBRILOY D2000AXH compound is based on Polycarbonate (PC) resin containing proprietary lubricant. Added features of this grade include: Wear Resistant, Healthcare.
EUROPEASIAAMERICAS
D2000I
LNP LUBRILOY D2000I compound is based on Polycarbonate (PC) resin containing proprietary lubricant. Added features of this grade include: Wear Resistant, High Impact.
EUROPEASIAAMERICAS
D2000P
LNP LUBRILOY D2000P compound is based on Polycarbonate (PC) resin containing proprietary lubricant. Added features of this grade include: Exceptional Processing, Wear Resistant.
EUROPEASIAAMERICAS
DF204
LNP LUBRILOY DF204 compound is based on Polycarbonate (PC) resin containing 20% glass fiber and a proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
DF2041
LNP LUBRILOY DF2041 compound is based on Polycarbonate (PC) resin containing 20% glass fiber and a proprietary lubricant. Added features of this grade include: Flame Retardant, Wear Resistant.
EUROPEASIAAMERICAS
DF206XXH
LNP LUBRILOY DF206XXH compound is based on Polycarbonate (PC) resin containing 30% glass fiber and a proprietary lubricant. Added features of this grade include: Wear Resistant, Healthcare.
EUROPEASIAAMERICAS
DX08333
LNP LUBRILOY DX08333 compound is based on Polycarbonate (PC) resin containing proprietary lubricant and carbon fiber. Added features of this grade include: ESD Safe, PTFE-free Wear & Friction Solution and Balanced Mechanical Performance.
EUROPEASIAAMERICAS
K2000
LNP LUBRILOY K2000 compound is based on Acetal (POM) resin containing proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
K2000XXH
LNP LUBRILOY K2000XXH compound is based on Acetal (POM) resin containing proprietary lubricant. Added features of this grade include: Wear Resistant, Healthcare.
EUROPEASIAAMERICAS
K2000XXL-NATURAL
LNP LUBRILOY K2000XXL compound is based on Acetal (POM) copolymer resin containing proprietary, non-PTFE lubrication. Added features include Wear Resistant, Low Extractable.
AMERICASASIAEUROPEGREATER CHINAMEA
K8000XXL-NATURAL
LNP LUBRILOY K8000XXL compound is based on Acetal (POM) copolymer resin contain proprietary non-PTFE lubrication. Added features include Wear Resistant, Low Extractable.
AMERICASASIAEUROPEGREATER CHINAMEA
N2000
LNP LUBRILOY N2000 compound is based on unfilled Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS). Added features of this grade include excellent BSR (Buzz, Squeak, Rattle) performance. Custom colorable, low gloss, internally lubricated without silicones or fluorinated polymers. Good impact and flow properties.
EUROPEASIAAMERICAS
R2000
LNP LUBRILOY R2000 compound is based on Nylon 6/6 resin containing proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
R2000A
LNP LUBRILOY R2000A compound is based on Nylon 6/6 resin containing proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
R2000AXP
LNP LUBRILOY R2000AXP compound is based on Nylon 6/6 resin containing proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
R2000I
LNP LUBRILOY R2000I compound is based on Nylon 6/6 resin containing proprietary lubricant. Added features of this grade include: High Impact, Wear Resistant.
EUROPEASIAAMERICAS
RF203
LNP LUBRILOY RF203 compound is based on Nylon 6/6 resin containing 15% glass fiber and proprietary lubricant. Added features of this grade include: Internally Lubricated, Wear Resistant.
EUROPEASIAAMERICAS
RF203AXH
LNP LUBRILOY RF203AXH compound is based on Nylon 6/6 resin containing 15% glass fiber and proprietary lubricant. Added features of this grade include: Wear Resistant, Healthcare.
EUROPEASIAAMERICAS
RF203XXH
LNP LUBRILOY RF203XXH compound is based on Nylon 6/6 resin containing 15% glass fiber and proprietary lubricant. Added features of this grade include: Wear Resistant, Healthcare.
EUROPEASIAAMERICAS
RF206
LNP LUBRILOY RF206 compound is based on Nylon 6/6 resin containing 30% glass fiber and proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
RF206AXH
LNP LUBRILOY RF206AXH compound is based on Nylon 6/6 resin containing 30% glass fiber and proprietary lubricant. Added features of this grade include: Wear Resistant, Healthcare.
EUROPEASIAAMERICAS
RF208
LNP LUBRILOY RF208 compound is based on Nylon 6/6 resin containing 40% glass fiber and proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
RX05497
LNP LUBRILOY RX05497 compound is based on Nylon 6/6 resin containing proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
RX05498
LNP LUBRILOY RX05498 compound is based on Nylon 6/6 resin containing proprietary lubricant. Added features of this grade include: High Impact, Wear Resistant.
EUROPEASIAAMERICAS
RX99650
LNP LUBRILOY RX99650 compound is based on Nylon 6/6 resin containing proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
U2000A
LNP LUBRILOY U2000A compound is based on Polyphthalamide (PPA) resin containing proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
UA200A
LNP LUBRILOY UA200A compound is based on Polyphthalamide (PPA) resin containing aramid fiber and proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
UX98388
LNP LUBRILOY UX98388 compound is based on Polyphthalamide (PPA) resin containing proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
UX99725
LNP LUBRILOY UX99725 compound is based on Polyphthalamide (PPA) resin containing proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
Z2000
LNP LUBRILOY Z2000 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing proprietary lubricant. Added features of this grade include: Wear Resistant.
EUROPEASIAAMERICAS
Z20001
LNP LUBRILOY Z20001 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing proprietary lubricant. Added features of this grade include: Wear Resistant, Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
ZX06315
LNP LUBRILOY ZX06315 is a compound based on PPE+PS Blend resin containing Flame Retardant, Proprietary Lubricant. Added features of this material include: Internally Lubricated, Non-Brominated & Non-Chlorinated Flame Retardant, Flame Retardant, high HDT.
LNP™ KONDUIT™ COMPOUND
Grades Available: 14
Available in: Europe, Asia, Americas
GENERAL INFORMATION
DESCRIPTION
KONDUIT compounds were the first thermally conductive composites commercially available. From 10 to 50 times more thermally conductive than conventional unfilled thermoplastics, Konduit compounds can conduct heat away from devices into a heat sink or the surrounding air, designed to extend product life and enhance design freedom.
BENEFITS
HIGH THERMAL CONDUCTIVITY
Provide thermal conductivity of 1-18 W/mK, enough for large amounts of heat transfer, opening up new freedom for part design and metal replacement.
STRENGTH
Small amounts of glass fiber reinforcement can be added to improve the strength of Konduit compounds.
INCREASED OPERATING EFFICIENCY AND LIFE SPAN
Thermal conductivity can increase the electrical efficiency of encapsulated motors by lowering the operating temperature, resulting in more available power and torque, lower current draw, faster response time, and longer device life than hotter-running devices.
COEFFICIENTS OF EXPANSION COMPARABLE TO METAL
Can be formulated to approximate the coefficient of linear thermal expansion (CLTE) of many metals, potentially reducing product failure and extending product life.
ENHANCES DESIGN FREEDOM
Provides vibration damping and are injection moldable.
GRADES
GRADES AVAILABLE: 14 (Clear Filters)
LIST VIEW: Expanded Compact
Availablity:
ANY REGION
Industry(s):
SELECT
Application(s):
SELECT
Processing technique(s):
SELECT
8TF29E
LNP KONDUIT 8TF29E compound is based on Liquid Crystal Polymer (LCP) resin containing 10% glass fibers proprietary thermal filler. Added features of this grade include: Thermally Conductive, Electrically Insulative, High flow, Low Moisture absorption, Low CTE values. This product is available in dark colours only.
EUROPEASIAAMERICAS
8TF36E
LNP KONDUIT 8TF36E compound is based on Liquid Crystal Polymer (LCP) resin containing 15% glass fibers and proprietary thermal filler. Added features of this grade include: Thermally Conductive, Electrically Insulative, High flow, Low Moisture Absorption, Low CTE values and suitable for light colors.
EUROPEASIAAMERICAS
DTK22
LNP KONDUIT DTK22 compound is based on Polycarbonate (PC) resin containing minerals. Added features of this grade include: Thermally Conductive and Electrically Insulative.
EUROPEASIAAMERICAS
OTF2B
LNP KONDUIT OTF2B compound is based on Polyphenylene Sulfide (PPS) resin containing 10% glass fiber and 55% proprietary thermal fillers. Added features of this grade include: Thermally Conductive.
EUROPEASIAAMERICAS
OX10324
LNP KONDUIT OX10324 compound is based on Polyphenylene Sulfide (PPS) resin containing glass fiber and proprietary thermal filler. Added features of this grade include: Thermally Conductive and Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
OX11314
LNP KONDUIT OX11314 compound is based on Polyphenylene Sulfide (PPS) resin containing mineral and glass fiber. Added features of this grade include: Thermally Conductive, Electrically Insulative and Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIA
OX11315
LNP KONDUIT OX11315 compound is based on Polyphenylene Sulfide (PPS) resin containing proprietary thermal filler. Added features of this grade include: Thermally Conductive, Electrically Insulative and Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
PX10323
LNP KONDUIT PX10323 compound is based on Nylon 6 resin containing glass fiber and proprietary thermal filler. Added features of this grade include: Thermally Conductive.
EUROPEASIA
PX10323H
LNP KONDUIT PX10323H compound is based on Nylon 6 resin containing glass fiber. Added features of this grade include: Thermally Conductive and Healthcare.
EUROPEASIA
PX11311
LNP KONDUIT PX11311 compound is based on Nylon 6 resin containing mineral and glass fiber. Added features of this grade include: Thermally Conductive, Electrically Insulative and Non-Brominated, Non-Chlorinated Flame Retardant.
ASIA
PX11311U
LNP KONDUIT PX11311U compound is based on Nylon 6 resin containing mineral and glass fiber. Added features of this grade include: Thermally Conductive, Electrically Insulative, Improved UV Stability and Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
PX11313
LNP KONDUIT PX11313 compound is based on Nylon 6 resin containing mineral and glass fiber. Added features of this grade include: Thermally Conductive, Electrically Insulative and Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
PX13012
LNP KONDUIT PX13012 compound is based on Nylon 6 resin containing proprietary thermal filler. Added features of this grade include: Thermally Conductive, Electrically Insulative and Non-Brominated, Non-Chlorinated Flame Retardant.
EUROPEASIAAMERICAS
PX13322
LNP KONDUIT PX13322 compound is based on Nylon 6 resin containing mineral and glass fiber. Added features of this grade include: Thermally Conductive, Electrically Insulative and Non-Brominated, Non-Chlorinated Flame Retardant.
