Key attributes
Other attributes
Place of Origin:United States
Brand Name:SABIC
Model Number:FARADEX ES003E
Packaging and delivery
Packaging Details:25kg per bag.
Few bags packing on cartons.
Large quantity packing on plastic pallet.
Port:ShenZhen
Supply Ability
Supply Ability:99999 Kilogram/Kilograms per Month
Samples
Maximum order quantity: 25 kilogramSample price:
Customization
Customized logo:Min. order: 25
Customized packaging:Min. order: 25
Graphic customization:Min. order: 25
For more customization details, message supplier
Place of origin:Georgia United State
Brand Name:SABIC LNP
Model Number:FARADEX ES003E
Material:Polyetherimide
Color:All
Type:Virgin
Feature:Proprietary Filler
MOQ:25KG
Form:Containing 15% Stainless Steel Fiber
Package:25 kg/bag
Certificate:COA
FARADEX ES003E
LNP™ FARADEX ES003E is an advanced compound developed by SABIC, featuring a base polyetherimide (PEI) resin filled with 15% stainless steel fiber. This unique formulation combines the exceptional properties of PEI with the enhanced electrical conductivity, EMI/RFI shielding capabilities, and thermal resistance imparted by the stainless steel fiber reinforcement.
Key Features
- Polyetherimide (PEI) Matrix: The PEI resin provides the compound with excellent mechanical strength, high temperature resistance, and dimensional stability, making it suitable for demanding applications.
- 15% Stainless Steel Fiber Reinforcement: The addition of stainless steel fibers enhances the compound’s electrical conductivity, allowing for static dissipation and providing effective electromagnetic interference (EMI) and radio-frequency interference (RFI) shielding.
- Electrical Conductivity: LNP™ FARADEX ES003E offers inherent electrical conductivity, making it suitable for applications where static charge dissipation is required to prevent damage to sensitive electronic components or to comply with safety standards.
- EMI/RFI Shielding: The stainless steel fiber reinforcement enables effective shielding against electromagnetic and radio-frequency interference, ensuring the integrity and reliability of electronic devices and systems.
- High Heat Resistance: This compound exhibits excellent resistance to high temperatures, maintaining its mechanical properties and dimensional stability even under elevated operating conditions.
- Easy Molding: LNP™ FARADEX™ Compound ES003E is designed for easy processing by injection molding, allowing for efficient fabrication of complex shapes and intricate components with high dimensional accuracy and surface finish.
Applications
- Non-Structural Components: Used in non-load-bearing components where electrical conductivity, EMI/RFI shielding, and high temperature resistance are required, such as enclosures, covers, and housings.
- Rigid Packaging: Applied in packaging applications requiring static dissipation and EMI/RFI shielding to protect sensitive electronic devices during transport and storage.
- Semiconductors: Utilized in semiconductor manufacturing equipment and components where static control and EMI/RFI shielding are essential for preventing damage to delicate semiconductor materials and devices.
- Electrical Components & Infrastructure: Used in electrical enclosures, connectors, and infrastructure components requiring static dissipation and EMI/RFI shielding to ensure reliable performance and safety.
- Electronic: Applied in electronic devices and assemblies where static charge dissipation and electromagnetic interference shielding are critical for preventing malfunctions and ensuring signal integrity.
- Industrial Material Handling: Used in equipment and machinery for industrial material handling applications requiring static control and EMI/RFI shielding to protect sensitive electronics and components.
- Commercial Appliances: Applied in commercial appliances and equipment where static dissipation and EMI/RFI shielding are necessary for reliable operation and compliance with regulatory standards.
Processing Method: Injection Molding