Key attributes
Other attributes
Place of Origin:United States
Brand Name:SABIC
Model Number:THERMOCOMP 5C003
Packaging and delivery
Packaging Details:25kg per bag.
Few bags packing on cartons.
Large quantity packing on plastic pallet.
Port:ShenZhen
Supply Ability
Supply Ability:99999 Kilogram/Kilograms per Month
Samples
Maximum order quantity: 25 kilogramSample price:
Customization
Customized logo:Min. order: 25
Customized packaging:Min. order: 25
Graphic customization:Min. order: 25
For more customization details, message supplier
Place of origin:United States
Brand Name:SABIC
Model Number:THERMOCOMP 5C003
Material:Polyvinylidene Fluoride
Color:All
Type:Virgin
Feature:15% Carbon Fiber
MOQ:25KG
Form:Granules Plastic Pellets
Package:25 kg/bag
Certificate:COA
THERMOCOMP 5C003
developed by SABIC under their LNP™ THERMOCOMP™ product line, is a high-performance compound engineered for demanding applications. This grade features polyvinylidene fluoride (PVDF) filled with 15% super strong carbon fiber, offering excellent mechanical and electrical properties. THERMOCOMP 5C003 is designed to provide electrical conductivity and is suitable for processing by injection molding. It finds applications in light-weight structural components, semiconductor devices, electronic material handling equipment, and various industrial applications where enhanced mechanical strength and electrical conductivity are required.
Key Features
- PVDF Matrix: THERMOCOMP 5C003 utilizes a polyvinylidene fluoride (PVDF) matrix known for its excellent chemical resistance, thermal stability, and mechanical strength.
- Super Strong Carbon Fiber Reinforcement: The compound is filled with 15% super strong carbon fiber, enhancing its mechanical properties and providing excellent electrical conductivity.
- Electrical Conductivity: THERMOCOMP 5C003 is specifically formulated to exhibit electrical conductivity, making it suitable for applications requiring this property, such as in semiconductor devices and electronic material handling equipment.
- Injection Molding Compatibility: Designed for processing by injection molding, THERMOCOMP 5C003 offers ease of fabrication into complex shapes and configurations, ensuring efficient manufacturing processes.
Applications
- Light-weight structural components
- Semiconductors
- Electronic material handling equipment
- Industrial applications requiring enhanced mechanical strength and electrical conductivity