Key attributes
Other attributes
Place of Origin:United States
Brand Name:SABIC
Model Number:THERMOCOMP 5C004
Packaging and delivery
Packaging Details:25kg per bag.
Few bags packing on cartons.
Large quantity packing on plastic pallet.
Port:ShenZhen
Supply Ability
Supply Ability:99999 Kilogram/Kilograms per Month
Samples
Maximum order quantity: 25 kilogramSample price:
Customization
Customized logo:Min. order: 25
Customized packaging:Min. order: 25
Graphic customization:Min. order: 25
For more customization details, message supplier
Place of origin:United States
Brand Name:SABIC
Model Number:THERMOCOMP 5C004
Material:Polyvinylidene Fluoride
Color:All
Type:Virgin
Feature:20% Carbon Fiber
MOQ:25KG
Form:Granules Plastic Pellets
Package:25 kg/bag
Certificate:COA
THERMOCOMP 5C004
is an advanced compound developed by SABIC under their LNP™ THERMOCOMP™ product line. Engineered for demanding applications, this grade features an electrically conductive polyvinylidene fluoride (PVDF) resin filled with 20% super strong carbon fiber. THERMOCOMP 5C004 is formulated to provide excellent electrical conductivity properties, making it suitable for applications in industries such as semiconductors, electronic material handling, and various industrial sectors.
Key Features
- PVDF Resin Matrix: 5C004 utilizes a polyvinylidene fluoride (PVDF) resin matrix known for its excellent chemical resistance, thermal stability, and mechanical strength.
- Filled with Super Strong Carbon Fiber: The compound is filled with 20% super strong carbon fiber, enhancing its mechanical strength and providing excellent electrical conductivity properties.
- Electrical Conductivity: THERMOCOMP 5C004 is specifically formulated to exhibit excellent electrical conductivity, making it suitable for applications requiring this property, such as in semiconductors and electronic material handling.
- Suitable for Injection Molding: Designed for processing by injection molding, THERMOCOMP 5C004 offers ease of fabrication into complex shapes and configurations, ensuring efficient manufacturing processes.
Applications
- Semiconductors
- Electronic material handling
- Industrial applications